Solder ball assembly, a method for its manufacture, and a method of forming solder bumps
AssigneeSenju Metal Industry Co., Ltd.
InventorsTakeo Kuramoto, Kaichi Tsuruta
Life of this patent
Estimating the term…
Abstract
A solder ball assembly includes a mask having first and second sides and a plurality of holes formed therein. Each hole has a first end opening onto the first side of the mask and a second end. A plurality of solder balls are disposed in the holes, and a fixing agent secures the solder balls in the holes. A protective sheet may be attached to one or both sides of the mask to cover the ends of the holes.
Claims21
A solder ball assembly comprising a mask having first and second sides and a plurality of holes formed therein, each hole having a first end opening onto the first side of the mask and a second end, a plurality of solder balls disposed in the holes, and a fixing agent securing the solder balls in the holes.
A ball assembly comprising a mask having first and second sides and a plurality of holes formed therein, each hole having a first end opening onto the first side of the mask and a second end, a plurality of balls disposed in the holes, and a fixing agent securing the balls in the holes, the balls comprising a material selected from metals, plastics, plated plastics, and ceramics.
A method of manufacturing a solder ball assembly comprising inserting a plurality of solder balls into holes formed in a mask, each hole having a first end opening onto a first side of the mask and a second end, each solder ball being inserted through the first end of a corresponding one of the holes, and fixing the solder balls in the holes with a fixing agent.
Dependencies are inferred from the claim text.