Bump pad design for flip chip bumping
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTai-Chun Huang, Tze-Liang Lee
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Abstract
Bump pads for flip chips in the packaging of semiconductor integrated circuits. The bump pads are each polygon-shaped and may be provided with multiple bonding apertures, in the form of slots or openings, to improve adhesion of solder bumps to the pads in the assembly of the flip chips. The edges of the flip chip may be provided with multiple interlock fingers and interlock slots which mate with respective interlock slots and fingers in the dielectric layer surrounding the pad in the chip.
Claims20
A bump pad for flip chip assembly, comprising:
- at least one polygon-shaped pad layer having at least one aperture extending at least partially through said at least one pad layer.
A bump pad for flip chip assembly, comprising:
- at least one polygon-shaped pad layer having at least five pad corners.
A bump pad for flip chip assembly, comprising:
- a polygon-shaped top pad layer and a polygon-shaped bottom pad layer beneath said top pad layer;
- and
- a plurality of apertures extending into at least said top pad layer.
The bump pad of claim 19 further comprising a plurality of via slots provided in said bottom pad layer.
Dependencies are inferred from the claim text.