Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device

Method for producing a composite (10, 16, 19) comprising a tested integrated circuit (10) and an electrical device (16), having the following steps:

• application of a flexible elevation (11) to a circuit substrate (10) of the integrated circuit;
• provision of a rewiring device (12, 13, 14, 15) on the circuit substrate (10) with the formation of a ring (15) around the flexible elevation (11) and on the flexible elevation (11) with the formation of a contact-making device (13) on the flexible elevation (11), the ring (15) and the contact-making device (13) being electrically conductively connected to one another;
• carrying out of a test of the integrated circuit (10) with temporary utilization of the contact-making device (13) on the flexible elevation (11);
• application of solder (18) to a contact device (17) of the electrical device (16);
• placement of the tested integrated circuit or the circuit substrate (10) onto the electrical device (16) with the contact-making device (13) being aligned with the contact device (17)—provided with solder (18)—of the electrical device (16);
• and
• reliquifaction of the solder (19) in such a way that it forms a permanent, fixed, electrically conductive connection (19) between the integrated circuit (10) and the electrical device (16).