Underfill gap enhancement

Abstract

A package substrate having pads for receiving an integrated circuit, where the improvement is the pads having a height of between about two mils and about three mils. In this manner, additional structures such as solder on the pads do not need to be added, and coined, in order to ensure a minimum gap between the package substrate and the monolithic integrated circuit. The pads may be formed of at least one of copper, nickel, and gold. Also described is a packaged integrated circuit having a package substrate with pads for receiving a monolithic integrated circuit, where the improvement is the pads having a height of between about two mils and about three mils. The monolithic integrated circuit is attached to the pads with solder bumps. Additionally described is a method of fabricating a package substrate, where the improvement is the step of forming pads on the package substrate to a thickness of between about two mils and about three mils, where the pads are adapted for receiving a monolithic integrated circuit. The pads are formed with a plating process. The monolithic integrated circuit is attached to the package substrate by reflowing the solder bumps between the contact pads of the monolithic integrated circuit and the pads of the package substrate, thereby forming a gap between the monolithic integrated circuit and the package substrate, which is under filled with an under fill material.

Dependencies are inferred from the claim text.