Back to results
US 2004/0070071 A1Published application
Diamond composite heat spreader and associated methods
OwnerChien-Min Sunginventor
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
OwnerChien-Min Sunginventor
Estimating the term…
Diamond heat spreaders are produced having thermal properties approaching that of pure diamond. Diamond particles of relatively large grain size are tightly packed to maximize diamond-to-diamond contact. Subsequently, smaller diamond particles may be introduced into the interstitial voids to further increase the diamond content per volume. An interstitial material is then introduced which substantially fills the remaining voids and should have favorable thermal properties as well as form chemical bonds with the diamond. Alternatively, the packed diamond may be subjected to ultrahigh pressures over 4 GPa in the presence of a sintering aid. The resulting diamond heat spreader has diamond particles which are substantially sintered together to form a continuous diamond network and small amounts of a sintering agent. The final heat spreader exhibits superior heat transfer properties advantageous in removing heat from various sources such as electronic devices and minimized difference in thermal expansion from the heat source.
A diamond composite heat spreader comprising:
A diamond heat spreader comprising a mass of diamond particles, wherein each diamond particle is substantially sintered to at least one other diamond particle.
A method of making a diamond composite heat spreader comprising the steps of:
A method of making a diamond heat spreader comprising the steps of:
Dependencies are inferred from the claim text.