Lid and heat spreader design for a semiconductor package
AssigneeHoneywell International Inc.
InventorJai Subramanian
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Abstract
The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention, a microelectronic lid comprises a material having a rectangular peripheral shape that defines 4 peripheral sides. Further, the lid has projecting peripheral rails along less than all of the peripheral edge. For instance, the lid can have projecting peripheral rails along only 2 of the sides. Alternatively, such microelectronic lid can be described as comprising a generally rectangular shape defining four peripheral edges, with two of the edges having a greater thickness than the other two edges.
Claims36
A microelectronic lid, comprising:
- a lid material having a shape and a peripheral edge surrounding the shape;
- a surface surrounded by the peripheral edge;
- and
- a rail which extends along only a portion of the peripheral edge and which is elevationally raised relative to the surface.
A method of forming a plurality of microelectronic lids, comprising:
- providing a bar of lid stock;
- forming a groove along a side of the bar;
- and
- after forming the groove, cutting the bar into a plurality of separated microelectronic lids.
A method of forming a plurality of microelectronic lids, comprising:
- extruding a lid stock material into a shape of a bar having a side, and a groove extending along the side;
- and
- after extruding the material, cutting the bar into a plurality of separated microelectronic lids.
Dependencies are inferred from the claim text.