Semiconductor package insulation film and manufacturing method thereof

A method for manufacture of a semiconductor package comprising the steps of:

• preparing insulation film having the following:
• two rows of sprocket holes comprising a plurality of sprocket holes formed at a pitch L along both edges of the insulation film, a plurality of through holes formed two-dimensionally at a pitch p between the rows of sprocket holes, a plurality of circuit patterns formed two-dimensionally upon the insulation film according to size of the semiconductor package, a for-plating-electricity-supply-use conductor pattern electrically connected with the plurality of circuit patterns having a main line surrounding the perimeter of the plurality of circuit patterns and a sub-line electrically connecting each of the circuit patterns to the main line;
• mounting of a semiconductor chip within a respective prescribed region of each circuit pattern of the insulation film and electrically connecting the semiconductor chips with the circuit patterns;
• performing resin sealing for partitioning off each region enclosed by the main line of the conductor pattern;
• and
• cutting apart into individual semiconductor packages by dicing along the sub-lines of the insulation film.