US 2004/0070067 A1 · Semiconductor device

Abstract

It is difficult to check the mounted state of solder by means of visual inspection after the mounting of a semiconductor device according to a conventional art, in particular, a CSP-semiconductor device, to a substrate and a problem arises wherein defective products increase and yield decreases. Terminals 50, 51, 52 and 53 for external connection are exposed from second main surface 412 of first insulating substrate 41 in the semiconductor device according to the present invention. Thus, second insulating substrate 48 is adhered to second main surface 412 so as to surround the internal portions of these terminals for external connection. Thereby, second insulating substrate 48 serves as a background mirror so that the mounted state of deep portions of the solder can be ascertained at the time of visual inspection of the mounted state of solder after the mounting of the semiconductor device to the substrate. As a result, the mounted state of the solder can be inspected without failure so that reduction in the number of defective products and increased yield can be attained.

Claims6

Dependent claims

A semiconductor device, comprising:

a first substrate formed of an insulating material having at least one through hole;
a semiconductor element secured to a desired position of a conductive pattern formed on a first main surface of said first substrate;
a metal wire for electrically connecting an electrode pad of said semiconductor element to said desired conductive pattern;
a plurality of electrodes for external connection on a second main surface of said first substrate located opposite to the first main surface of said first substrate that is electrically connected to said desired conductive pattern via said through hole;
a resin mold formed so as to cover, at least, the main surfaces of said first substrate, wherein
the semiconductor device is characterized in that a second substrate formed of an insulating material having approximately the same coefficient of linear expansion as said first substrate is adhered to the second main surface of said first substrate so that, at least, said electrodes for external connection are exposed.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor device

Life of this patent

Semiconductor device

Life of this patent

Abstract

Claims6