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US 2004/0070064 A1Published application
Semiconductor device and fabrication method of the same
AssigneeOki Electric Industry Co., Ltd.
InventorsTae Yamane, Jyouji Katsuno, Kiyohisa Fukaya
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Abstract
A semiconductor device includes semiconductor chips, a first conductive pattern, an external terminal and an encapsulating resin. Each of the semiconductor chips has a front side formed with integrated circuits and a back side. The semiconductor chips are stacked each other. The first conductive pattern electrically connects the integrated circuits. The external terminal is electrically connected to the first conductive pattern. The encapsulating resin encapsulates the semiconductor chips and the first conductive pattern.
Claims12
A semiconductor device comprising:
- a plurality of semiconductor chips each of which has a front side formed with a plurality of integrated circuits and a back side, the semiconductor chips being stacked;
- a first conductive pattern electrically connecting the integrated circuits;
- an external terminal electrically connected to the first conductive pattern;
- and
- an encapsulating resin for encapsulating the semiconductor chips and the first conductive pattern.
2 more elements
Dependencies are inferred from the claim text.