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US 2004/0070059 A1Published application
Semiconductor device having sealing structure for wide gap type semiconductor chip
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsYukitaka Hori, Katsumi Satoh, Norihisa Asano
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Abstract
A semiconductor chip and connection ends of corresponding external electrode terminals are encapsulated with a glass based sealing material, and the semiconductor chip includes a wide gap semiconductor element, and the electrodes of the semiconductor chip are connected to the end portions of the external electrode terminals by a silver based brazing member and/or pressure contact.
Claims3
A semiconductor device having a sealing structure for a semiconductor chip, comprising:
- a plurality of main electrodes provided on main surfaces of the semiconductor chip;
- a plurality of external electrodes electrically connected to the main electrodes via connection members, respectively;
- a sealing member made of a glass based sealing material for encapsulating at least the semiconductor chip, the main electrodes and the connection members;
- and
- a brazing member made of a silver based brazing material having a high fusing point, which is provided for integrally connecting between a part of the main electrodes and a part of the external electrodes,
- wherein the semiconductor chip is of a wide gap type, and the fusing point of the glass based sealing material is lower than that of the silver based brazing material.
3 more elements
A semiconductor device having a sealing structure for a semiconductor chip, comprising:
- a plurality of main electrodes provided on main surfaces of the semiconductor chip;
- a plurality of external electrodes directly and electrically connected to the main electrodes by pressure contact, respectively;
- and
- a sealing member made of a glass based sealing material for encapsulating at least the semiconductor chip, the main electrodes and connected portions of the external electrodes,
- wherein the semiconductor chip is of a wide gap type.
2 more elements
Dependencies are inferred from the claim text.