Lead frame and method of manufacturing the same

A lead frame comprising:

• a plurality of leads arranged along a periphery of an area which is to be ultimately separated as a semiconductor device for a semiconductor element mounting region;
• and
• a conductor portion for power/ground terminal formed to at least partially surround a periphery of the semiconductor element mounting region in an area between the semiconductor element mounting region and the plurality of leads corresponding to the semiconductor element mounting region,
• wherein the plurality of leads and the conductor portion for power/ground terminal are supported by an adhesive tape.

A method of manufacturing a lead frame, comprising the steps of:

• forming a base frame by etching or stamping a metal plate, in which a plurality of unit base frames are linked to one another, and have a die-pad, a plurality of leads corresponding to the die-pad, and a conductor portion for power/ground terminal arranged for a semiconductor element to be mounted on the die-pad, the conductor portion at least partially surrounding the die-pad in an area between the die-pad and the plurality of leads, and being linked to the die-pad;
• forming a concave portion in a portion linking the conductor portion and the die-pad on one surface of the base frame;
• attaching an adhesive tape on the surface of the base frame where the concave portion is formed;
• and
• cutting off a portion of the base frame where the concave portion is formed.

A method of manufacturing a lead frame, comprising the steps of:

• forming a base frame by simultaneously etching a metal plate on both surfaces thereof using resist patterned in a predetermined shape for each surface of the metal plate, in which a plurality of unit base frames are linked to one another, and have a die-pad, a plurality of leads corresponding to the die-pad, and a conductor portion for power/ground terminal arranged for a semiconductor element to be mounted on the die-pad, the conductor portion at least partially surrounding the die-pad in an area between the die-pad and the plurality of leads, and being linked to the die-pad, and simultaneously forming a concave portion in a portion linking the conductor portion and the die-pad on one surface of the base frame;
• attaching an adhesive tape on the surface of the base frame where the concave portion is formed;
• and
• cutting off a portion of the base frame where the concave portion is formed.

A method of manufacturing a lead frame, comprising the steps of:

• forming a base frame by etching or stamping a metal plate, in which a plurality of unit base frames are linked to one another, and have a semiconductor element mounting region, a plurality of leads corresponding to the semiconductor element mounting region, and a conductor portion for power/ground terminal arranged for a semiconductor element to be mounted on the semiconductor element mounting region, the conductor portion at least partially surrounding the semiconductor element mounting region in an area between the semiconductor element mounting region and the plurality of leads, and being linked to at least one lead among the plurality of leads;
• forming a concave portion in a portion linking the conductor portion and the at least one lead on one surface of the base frame;
• attaching an adhesive tape on the surface of the base frame where the concave portion is formed;
• and
• cutting off a portion of the base frame where the concave portion is formed.

A method of manufacturing a lead frame, comprising the steps of:

• forming a base frame by simultaneously etching a metal plate from both surfaces thereof using resist patterned in a predetermined shape for each surface of the metal plate, in which a plurality of unit base frames are linked to one another, and have a semiconductor element mounting region, a plurality of leads corresponding to the semiconductor element mounting region, and a conductor portion for power/ground terminal arranged for a semiconductor element to be mounted on the semiconductor element mounting region, the conductor portion at least partially surrounding the semiconductor element mounting region in an area between the semiconductor element mounting region and the plurality of leads, and being linked to at least one lead among the plurality of leads, and simultaneously forming a concave portion in a portion linking the conductor portion and the at least one lead on one surface of the base frame;
• attaching an adhesive tape on the surface of the base frame where the concave portion is formed;
• and
• cutting off a portion of the base frame where the concave portion is formed.