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US 2004/0070055 A1Published application
Ground plane for exposed package
AssigneeSt Assembly Test Services Pte Ltd
InventorsJeffrey D. Punzalan, Hien Boon Tan, Zheng Zheng, Jae Hak Yee, Byung Joon Han
Life of this patent
Estimating the term…
Abstract
A new design is provided for the design of a leadframe of a semiconductor package. A ground plane is added to the design of the leadframe, the ground frame is located between the leadframe and the die attach paddle over which the semiconductor device is mounted.
Claims37
An interface for mounting a semiconductor device in a semiconductor package, comprising:
- a die attach paddle;
- a leadframe;
- and
- a ground plane as a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame.
1 more element
A semiconductor device package, comprising:
- a semiconductor device, said semiconductor device being mounted over a die attach paddle after a layer of die attach paste has been deposited over the surface of said die attach paddle;
- a leadframe, conductive traces having been provided over the surface of said lead frame;
- a ground plane, forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame;
- first conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame;
- second conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said ground plane;
- and
- a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
4 more elements
A method of creating a semiconductor device package, comprising the steps of:
- providing a semiconductor device;
- providing a leadframe, conductive traces having been provided over the surface of said lead frame;
- providing a ground plane, said ground plane forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame;
- depositing a layer of die attach paste over the surface of said die attach paddle;
- mounting said semiconductor device over said layer of die attach paste, thereby mounting said semiconductor device over said die attach paddle;
- providing first conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame;
- providing second conductive interconnects between points of electrical contact on an active surface of the semiconductor lie and said ground plane;
- and
- providing a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lad frame by a measurable amount.
6 more elements
An interface for mounting a semiconductor device in a semiconductor package, comprising:
- a die attach paddle;
- a leadframe;
- and
- a ground plane as a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame, said physical and thereto connected interface between said die attach paddle and said lead frame comprising metal interconnects in metal strip form, a plane of said metal interconnects intersecting a plane of said die attach paddle under an angle.
1 more element
A semiconductor device package, comprising:
- a semiconductor device, said semiconductor device being mounted over a die attach paddle after a layer of die attach paste has been deposited over the surface of said die attach paddle;
- a leadframe, conductive traces having been provided over the surface of said lead frame;
- a ground plane, forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame;
- first conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame, said first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires;
- second conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said ground plane;
- and
- a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
4 more elements
A semiconductor device package, comprising:
- a semiconductor device, said semiconductor device being mounted over a die attach paddle after a layer of die attach paste has been deposited over the surface of said die attach paddle;
- a leadframe, conductive traces having been provided over the surface of said lead frame;
- a ground plane, forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame;
- first conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame, said first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires;
- second conductive interconnects having been provided between points of electrical contact on an active surface of the semiconductor die and said ground plane, said second conductive interconnects comprising ground wires;
- and
- a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
4 more elements
A method of creating a semiconductor device package, comprising the steps of:
- providing a semiconductor device;
- providing a leadframe, conductive traces having been provided over the surface of said lead frame;
- providing a ground plane, said ground plane forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame;
- depositing a layer of die attach paste over the surface of said die attach paddle;
- mounting said semiconductor device over said layer of die attach paste, thereby mounting said semiconductor device over said die attach paddle;
- providing first conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame, first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires;
- providing second conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said ground plane;
- and
- providing a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said load frame by a measurable amount.
6 more elements
A method of creating a semiconductor device package, comprising the steps of:
- providing a semiconductor device;
- providing a leadframe, conductive traces having been provided over the surface of said lead frame;
- providing a ground plane, said ground plane forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame;
- depositing a layer of die attach paste over the surface of said die attach paddle;
- mounting said semiconductor device over said layer of die attach paste, thereby mounting said semiconductor device over said die attach paddle;
- providing first conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame, first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires;
- providing second conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said ground plane, said second conductive interconnects comprising ground wires;
- and
- providing a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
6 more elements
Dependencies are inferred from the claim text.