Terahertz interconnect system and applications

In an assembly including at least a first electrical circuitry for providing a first electrical signal containing data and a second electrical circuitry for receiving a second electrical signal, a method comprising:

• at a first location, receiving said first electrical signal from said first electrical circuitry;
• converting said first electrical signal into an electromagnetic signal containing at least a portion of said data, said electromagnetic signal having a carrier frequency greater than 300 GHz;
• at a second location, receiving said electromagnetic signal;
• converting said electromagnetic signal into said second electrical signal containing at least some of said portion of said data;
• and
• directing said second electrical signal to said second electrical circuitry.

An assembly comprising:

• a first electrical circuitry for providing a first electrical signal containing data;
• a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data;
• a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data;
• and
• a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,
• wherein at least one of said transmitting and receiving arrangements includes an electron tunneling device, said electron tunneling device including
• first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and
• an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling.

An assembly comprising:

• a first electrical circuitry for providing a first electrical signal containing data;
• a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data, said electromagnetic signal having a carrier frequency of at least three gigahertz;
• a receiving arrangement for receiving said electromagnetic signal and converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data;
• and
• a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,
• wherein at least one of said transmitting and receiving arrangements includes an electron tunneling device.

An assembly comprising:

• a first electrical circuitry for providing a first electrical signal containing data;
• a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data;
• a receiving arrangement for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data;
• and
• a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,
• wherein at least one of said transmitting and receiving arrangements includes a metal-insulator-based, electron tunneling device.

An assembly comprising:

• a first electrical circuitry for providing a first electrical signal containing first data;
• a first transceiver arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into a first electromagnetic signal containing at least a portion of said first data;
• a second transceiver arrangement configured for receiving said first electromagnetic signal and for converting said first electromagnetic signal into a second electrical signal containing at least some of said portion of said first data;
• and
• a second electrical circuitry connected with said second transceiver arrangement and configured for receiving said second electrical signal,
• wherein at least one of said first and second transceiver arrangements includes an electron tunneling device, said electron tunneling device including
• first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and
• an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling.

An assembly comprising:

• a first electrical circuitry for providing a first electrical signal containing data;
• a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data;
• a receiving arrangement for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data;
• and
• a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,
• wherein at least one of said transmitting and receiving arrangements is configured to provide electron tunneling and includes an antenna connected therewith.

An assembly comprising:

• first electrical means for providing a first electrical signal containing data;
• transmitting means connected with said first electrical means and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data;
• receiving means for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data;
• and
• second electrical means connected with said receiving means and configured for receiving said second electrical signal,
• wherein at least one of said transmitting and receiving means includes means for providing electron tunneling with an antenna connected therewith.

An assembly comprising:

• a first electrical circuitry for providing a first electrical signal containing data;
• a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data, said electromagnetic signal having a carrier frequency greater than 300 GHz;
• a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data;
• and
• a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,
• wherein said transmitting arrangement and said receiving arrangement are disposed in close proximity to one another such that said electromagnetic signal is transmitted from said transmitting arrangement to said receiving arrangement at least in part by means of coupled-mode energy transfer.

An assembly comprising:

• a first electrical circuitry for providing a first electrical signal containing data;
• a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data;
• a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data;
• and
• a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,
• wherein at least one of said transmitting and receiving arrangements includes an electron tunneling device, said electron tunneling device including
• first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and
• an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons includes, at least in part, transport by means of tunneling, and
• wherein said transmitting arrangement and said receiving arrangement are disposed in close proximity to one another such that said electromagnetic signal is transmitted from said transmitting arrangement to said receiving arrangement at least in part by means of coupled-mode energy transfer.

An assembly comprising:

• a substrate;
• an integrated circuit package supported on said substrate and containing
• an integrated circuit module configured for providing an output electrical signal containing output data, and
• a transceiver arrangement connected with said integrated circuit module for receiving said output electrical signal and for converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data;
• and
• a waveguide having a first segment and a distinct, second segment, said first segment being also supported on said substrate and configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide.

An assembly comprising:

• a substrate;
• an integrated circuit package including
• an integrated circuit module for providing an output electrical signal containing output data, and
• a plurality of electrical pin-outs for directing said output electrical signal away from said integrated circuit module and away from said integrated circuit package;
• a socket arrangement supported on said substrate and configured for receiving said integrated circuit package thereon, said socket arrangement including a transceiver arrangement disposed therein such that said transceiver arrangement receives said output electrical signal from said plurality of electrical pin-outs and converts said output electrical signal into an output electromagnetic signal containing at least a portion of said output data;
• and
• a waveguide having a first segment and a distinct, second segment, said first segment being also supported on said substrate and configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide.

An assembly comprising:

• a substrate;
• an integrated circuit package supported on said substrate and containing an integrated circuit module, said integrated circuit module being configured for providing an output electrical signal containing output data;
• an electrical interconnect also supported on said substrate and having first and second ends, said first end being connected with said integrated circuit module through said integrated circuit package and configured to receive said output electrical signal such that said output electrical signal is directed through said electrical interconnect toward said second end;
• a transceiver package also supported on said substrate and including a transceiver chip, said transceiver chip being connected with said second end of said electrical interconnect such that said transceiver chip receives said output electrical signal and converts said output electrical signal into an output electromagnetic signal containing at least a portion of said output data;
• and
• a waveguide having a first segment, said first segment being also supported on said substrate and configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward a distinct, second segment of said waveguide.

In a system including an integrated circuit module configured for providing an output electrical signal containing output data, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

• a substrate;
• an integrated circuit package supported on said substrate and configured for accommodating said integrated circuit module thereon, said integrated circuit packaging including a transceiver arrangement connected with said integrated circuit module for receiving said output electrical signal and for converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data;
• and
• a waveguide having a first segment and a distinct, second segment, said first segment being also supported on said substrate and configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide.

In a system including an integrated circuit package, which integrated circuit package includes an integrated circuit module, for providing an output electrical signal containing output data, and a plurality of electrical pin-outs, for directing said output electrical signal away from said integrated circuit module and away from said integrated circuit package, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

• a substrate;
• a socket arrangement supported on said substrate and configured for receiving said integrated circuit package thereon, said socket arrangement including a transceiver arrangement disposed therein such that said transceiver arrangement receives said output electrical signal from said plurality of electrical pin-outs and converts said output electrical signal into an output electromagnetic signal containing at least a portion of said output data;
• and
• a waveguide having a first segment and a distinct, second segment, said first segment being also supported on said substrate and configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide.

In a system including an integrated circuit package, which integrated circuit package includes an integrated circuit module configured for providing an output electrical signal containing output data, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

• a substrate configured for supporting said integrated circuit module thereon, said substrate including
• an electrical interconnect having first and second ends, said first end being connected with said integrated circuit module through said integrated circuit package and configured to receive said output electrical signal such that said output electrical signal is directed through said electrical interconnect toward said second end,
• a transceiver package including a transceiver chip, said transceiver chip being connected with said second end of said electrical interconnect such that said transceiver chip receives said output electrical signal and converts said output electrical signal into an output electromagnetic signal containing at least a portion of said output data, and
• a waveguide having a first segment and a distinct, second segment, said first segment being configured for receiving at least a portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal toward said distinct, second segment of said waveguide.

In a system including an integrated circuit module configured for providing an output electrical signal containing output data, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

• an integrated circuit package configured for accommodating said integrated circuit module thereon, said integrated circuit package including a transceiver arrangement connected with said integrated circuit module and configured for
• receiving said output electrical signal,
• converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data, and
• directing said output electromagnetic signal away from said integrated circuit package.

In a system including an integrated circuit package, which integrated circuit package includes an integrated circuit module, for providing an output electrical signal containing output data, and a plurality of electrical pin-outs, for directing said output electrical signal away from said integrated circuit module and away from said integrated circuit package, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

• a socket arrangement configured for accommodating said integrated circuit package thereon, said socket arrangement including a transceiver arrangement configured for
• receiving said output electrical signal from said plurality of electrical pin-outs,
• converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data, and
• directing said output electromagnetic signal away from said socket arrangement.

In a system including an integrated circuit package, which integrated circuit package includes an integrated circuit module configured for providing an output electrical signal containing output data, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

• an electrical interconnect having first and second ends, said first end being connected with said integrated circuit module through said integrated circuit package and configured to receive said output electrical signal such that said output electrical signal is directed through said electrical interconnect toward said second end,
• a transceiver package including a transceiver chip, said transceiver chip being connected with said second end of said electrical interconnect and configured for
• receiving said output electrical signal,
• converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data, and
• directing said output electromagnetic signal away from said transceiver package.