Solder pastes
AssigneesSenju Metal Industry Co., Ltd., Matsushita Electric Industrial Co., Ltd.
InventorsToshihiko Taguchi, Kunihito Takaura, Setsuko Tadokoro, Masahiko Hirata, Hisahiko Yoshida, Takashi Nagashima
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Abstract
A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01-10.0 wt % of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.
Claims10
A solder paste comprising a powder of an Sn-based, lead-free solder mixed with a rosin-based flux, characterized in that the rosin-based flux contains 0.5-0.0 wt % of at least one isocyanuric compound selected from isocyanuric acid and derivatives thereof having no hydroxyl group.
A solder paste comprising a r of an Sn-based, lead-free solder mixed with a rosin-based flux, characterized in that the rosin-based flux contains 0.01-10.0 wt % of at least one salicylamide compound selected from salicylamide and derivatives thereof.
Dependencies are inferred from the claim text.