Method and device for applying a solder to a substrate
OwnerGhassem Azdasht, Lars Titerleinventors
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Abstract
The invention is a method for applying a solder to a substrate by positioning it in its solid physical condition, melting it and then impacting it against a substrate by means of compressed gas. The device for applying a solder (7) to a substrate (10, 11) comprises a holder (1) having a capillary bore (2) whose diameter, at the substrate end (3), has a contraction (4) whose diameter (D2) is smaller than the diameter (D3) of the solder globule (7).
Claims7
A process for applying solder on a substrate comprising providing solder in a sold aggregate state, positioning solder relative to the substrate, providing an energy source, and melting the solder by activating the supply of energy, characterized in that the positioning is realized by spacing solder a predetermined distance from the substrate, and impacting the solder against the substrate by action of a compressed gas after melting of the solder.
A device for applying solder onto a substrate comprising a holder having a capillary therein in which a solder ball can be positioned relative to the substrate, the end of the capillary (2) nearer the substrate having a tapered section (4), whose smallest diameter (D2) is smaller than the diameter (D3) of the solder ball (7).
Dependencies are inferred from the claim text.