Production method for flexible printed board
AssigneesTokai Rubber Industries, Ltd., Okuno Chemical Industries Co., Ltd.
InventorsNaoki Katayama, Yasuhiro Hayashi, Joonhaneng Kang
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Abstract
A flexible printed board production method which ensures higher adhesion of copper, excellent workability, easier continuous production and lower costs. The flexible printed board production method comprises the steps of: treating a surface of a polyimide resin film with plasma or short wavelength ultraviolet radiation; activating the treated surface with the use of an alkali metal hydroxide; electrolessly plating the surface of the polyimide resin film with nickel; and electroplating the electrolessly plated surface of the polyimide resin film with copper, whereby a copper layer is formed on the surface of the polyimide resin film.
Claims18
A production method for a flexible printed board, comprising the steps of:
- treating a surface of a polyimide resin film with plasma or short wavelength ultraviolet radiation;
- activating the treated surface with the use of an alkali metal hydroxide;
- electrolessly plating the surface of the polyimide resin film with nickel or a nickel alloy;
- and
- electroplating the electrolessly plated surface of the polyimide resin film with copper, whereby a copper layer is formed on the surface of the polyimide resin film.
Dependencies are inferred from the claim text.