Method for electroplating on resistive substrates

A method for electroplating an electrically conductive material onto a platable resitive metal barrier layer(s) located on a substrate which comprises:

• contacting the substrate with a plating bath that optionally comprises a super filling additive and a suppressor,
• applying a current or voltage across electrodes, wherein the substrate acts as one electrode and a conductor acts as a counter electrode to plate the electrically conductive material on the substrate;
• changing the current from an initially small or zero value to a final, higher value corresponding to a desired current density for the total plated area, or changing the voltage from an initial small or zero value corresponding to an open-circuit potential or a small overpotential to a final larger voltage corresponding to a large overpotential for deposition.