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US 2004/0069644 A1Published application
Preparing a wafer for electroplating
OwnerDavid C. Nelsen, Rajiv Rastogiinventors
Life of this patent
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Abstract
A wafer is prepared for electroplating via a spin, rinse and dry process performed on the wafer prior to electroplating. The process may be performed in a standalone tool or may be performed in a preclean module integrated into an electroplating tool.
Claims19
A method comprising:
- rinsing a wafer with an aqueous solution;
- drying the wafer;
- and
- electroplating a metal onto at least a portion of the wafer after rinsing the wafer and drying the wafer.
1 more element
A method comprising:
- placing a wafer in a spin rinse dry module integrated within a tool;
- rinsing the wafer with an aqueous solution;
- drying the wafer;
- and
- electroplating a metal onto at least a portion of the wafer after rinsing the wafer and drying the wafer.
2 more elements
An apparatus comprising:
- a semiconductor tool having at least a first module and a second module integrated therein;
- the first module comprising a spin rinse dry module to spin, rinse, and dry a wafer;
- the second module comprising an electroplating module to electroplate a metal onto at least a portion of the wafer;
- and
- a transport mechanism to deliver the wafer to the electroplating module from the spin rinse dry module.
2 more elements
Dependencies are inferred from the claim text.