Non-cyanogen type electrolytic solution for plating gold
AssigneeShinko Electric Industries Co., Ltd.
InventorsMiwa Abe, Kei Imafuji
Life of this patent
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Abstract
A non-cyanogen type electrolytic solution, for plating gold, contains a gold salt as a supply source of gold and is added with a non-cyanogen type compound wherein the electrolytic plating solution is added with one selected from a group of thiouracil; 2-aminoethanethiol; N-methylthiourea, 3-amino-5-mercapto-1,2,4-triazole; 4,6-dihydroxy-2-mercaptopyrimidine; and mercapto-nicotinate; as a compound forming a complexing compound with gold. Chloroaurate or gold sulfite is preferably used as a gold salt.
Claims7
A non-cyanogen type electrolytic solution for plating gold, containing gold salt as a supply source of gold and added with a non-cyanogen type compound, wherein the electrolytic plating solution is added with one selected from a group of thiouracil;
- 2-aminoethanethiol;
- N-methylthiourea, 3-amino-5-mercapto-1,2,4-triazole;
- 4,6-dihydroxy-2-mercaptopyrimidine;
- and mercapto-nicotinate;
- as a compound forming a complexing compound with gold:
A gold plating method using a non-cyanogen type electrolytic solution, containing gold salt as a supply source of gold and added with a non-cyanogen type compound, wherein the electrolytic plating solution is added with one selected from a group of thiouracil;
- 2-aminoethanethiol;
- N-methylthiourea, 3-amino-5-mercapto-1,2,4-triazole;
- 4,6-dihydroxy-2-mercaptopyrimidine;
- and mercapto-nicotinate;
- as a compound forming a complexing compound with gold.
Dependencies are inferred from the claim text.