Metal pattern formation
OwnerHeinrich Meyer, Udo Grieserinventors
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Abstract
A method of reproducibly manufacturing circuit carriers with very fine circuit structures and an electrophoretic varnish to be applied in this method are described in which a dielectric substrate comprising a base metal surface is provide, a varnish layer is applied onto the substrate surface electrodepositing the electrophoretic varnish, thereafter the varnish layer is ablated in at least parts of the regions that do not correspond to the metal pattern to be formed by means of ultraviolet radiation, the base metal surface being laid bare, and finally the bare base metal surface is etched.
Claims25
Method of forming a metal pattern on a dielectric substrate comprising the following method steps:
- a) providing a substrate comprising a base metal surface;
- b) applying a varnish layer to the substrate by means of an electrophoretic process,
- c) ablating the varnish layer in at least parts of regions that do not correspond to the metal pattern to be formed, the base metal surface being laid bare by means of ultraviolet radiation;
- d) etching of the base metal surface that has been laid bare,
- wherein the varnish contains at least one ablation amplifier adjusted to ultraviolet radiation.
Method according to one of the previous claims, wherein the ablation amplifier is selected from the group comprising derivatives of acetophenone, benzophenone, cinnamic acid, tropolone, further diphenylbutadienes and the derivatives thereof, chrysenes, diphenylfulvenes, dipyridyl amines, phenoxazines, 2-phenyl benzimidazoles, isoquinoline oxides, nitrophenoles, nitroanilines, ω-nitrostyrenes and 1.5-dinitronaphthalines
Method according to one of the previous claims, wherein the ultraviolet radiation is generated by a laser.
Method according to one of the previous claims, wherein the ultraviolet radiation is generated by an excimer laser.
Method according to one of the previous claims, wherein the varnish layer is formed with an anaphoretic varnish.
Method according to one of the previous claims, wherein the varnish is formed with at least one copolymer produced by copolymerization of monomers, selected from the group comprising methacrylic acid, C1-C2 alkyl methacrylate, C3-C10 alkyl (meth)acrylate and hydroxy alkyl methacrylate;
- the alkyl groups of which have 2-4 carbon atoms.
Method according to one of the previous claims, wherein the varnish is anaphoretic and contains at least one base selected from the group comprising mono, di, trialkyl amines, monoethanol amine, morpholine, ammonia and sodium hydroxide.
Method according to one of the previous claims, wherein the varnish layer is removed from the based metal surface after method step d).
Electrophoretic varnish containing at least one ablation amplifier adjusted to ultraviolet radiation.
Dependencies are inferred from the claim text.