Thermal interface wafer and method of making and using the same
AssigneeLoctite Corporation
InventorRobert A. Rauch
Life of this patent
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Abstract
A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.
Claims36
A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink when interposed therebetween, said wafer comprising at least one planar substrate having first and second surfaces with edges, said substrate having at least one layer of conformable, heat-conductive material formed upon a respective surface thereof, said heat-conductive material being formulated to enhance the heat transfer from said electronic component to said heat sink, wherein the wafer is disposed to assume a substantially perpendicular orientation relative to the electronic component whereby the edges of the wafer contact the electronic component and the heat sink.
A thermal interface for facilitating heat transfer from an electronic component to a heat sink comprising at least one elongate planar strip substrate having first and second sides with at least one layer of conformable, heat-conducting material formed upon a respective one of said sides, said at least one strip with at least one layer of heat-conducting material formed thereon being formed as a cross-sectional portion of an outwardly-spiraling coil to define a wafer interposable between said electronic component and said heat sink.
A thermal interface for facilitating heat transfer from an electronic component to a heat sink comprising a multiplicity of elongate, planar substrates, each respective substrate having at least one layer of conformable, heat-conducting material formed thereon, said multiplicity of elongate strips being formed in generally parallel relation to one another to define a wafer interposable between said electronic component and said heat sink.
A method for facilitating the transfer of heat from an electronic component to a heat sink across an interface therebetween, the method comprising the steps:
- a) providing a thermal interface interposable between said electronic component and said heat sink, said wafer comprising at least one planar substrate having first and second surfaces, said substrate having at least one layer of conformable, heat-conductive material formed upon a respective surface thereof, said heat-conductive material being formulated to enhance the heat transfer from said electronic component to said heat sink;
- b) interposing the thermal interface wafer of step a) between said electronic component and said heat sink such that the planar substrate of such wafer assumes a substantially perpendicular orientation relative said electronic component and said heat sink;
- and
- c) compressively engaging said electronic component to said heat sink with said thermal interface disposed therebetween.
A method for fabricating a thermal interface for facilitating heat transfer from an electronic component to a heat sink, the method comprising the steps:
- a) providing a planar, thermally-conductive sheet having first and second sides;
- b) forming a layer of conformable, heat-conductive material upon at least one of said sides of said sheet provided in step (a);
- c) rolling the sheet with heat-conducting material formed thereon in step (b);
- d) slicing cross-sectional cuts through the rolled sheet with heat-conductive material formed thereon in step (c).
Dependencies are inferred from the claim text.