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OwnerOsamu Suenaga, Sadao Kobayashi +2inventors
InventorsOsamu Suenaga, Sadao Kobayashi, Naoki Mori, Hiromu Ito
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An exhaust-heat utilization system is constructed which can achieve energy saving of semiconductor manufacturing facilities by reusing a warmed cooling-water, as a heating source, exhausted from semiconductor manufacturing apparatuses. Supply a low-temperature cooling-water having a temperature substantially equal to a room temperature to the semiconductor manufacturing apparatuses (2, 4, 6, 8, 10) through a low-temperature cooling-water line (12). Supply a medium-temperature cooling-water to the semiconductor manufacturing apparatus (8) through a medium-temperature cooling-water supply line (30), the medium-temperature cooling-water being exhausted from the semiconductor manufacturing apparatuses and having a temperature higher than the room temperature. Supply, as a heating source, a high-temperature cooling-water to a the semiconductor apparatuses (6, 10) through a high-temperature cooling-water supply line (32), the high-temperature cooling-water exhausted from the semiconductor manufacturing apparatuses (2, 4) and having a temperature still higher than the medium-temperature cooling-water.
An exhaust-heat utilization system of a semiconductor manufacturing facility having a plurality of semiconductor manufacturing apparatuses, comprising:
An exhaust-heat utilization method of a semiconductor manufacturing facility having a plurality of semiconductor manufacturing apparatuses, comprising the steps of:
A semiconductor manufacturing facility, comprising:
A heat recovery system of a semiconductor manufacturing plant having a plurality of semiconductor manufacturing apparatuses and an outside-air conditioning unit which supplies an outside air to the semiconductor manufacturing apparatuses after applying an air-conditioning process, comprising two cooling-water systems that are a cooling-water supply system which supplies a cooling water of a room temperature for cooling said semiconductor manufacturing apparatuses, and a cooling-water recovery system including piping, a tank and a pump for recovering the cooling water that is exhausted after cooling said semiconductor manufacturing apparatuses, wherein the cooling water exhausted from said semiconductor manufacturing apparatuses and recovered by said cooling-water recovery system is supplied to other semiconductor manufacturing apparatuses requiring heating and/or said outside-air conditioning unit.
Dependencies are inferred from the claim text.