Loading patent…
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsAkihiro Yamamoto, Sakae Kobayashi, Shinzou Eguchi, Kazuhiro Murata, Kouichi Yoshida
Estimating the term…
An object of the present invention is to provide an apparatus and method for determining a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes the steps of: measuring an actual size of the bonding portion of the circuit electrode at the first temperature; comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature; and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.
A circuit electrode bonding method for bonding a bonding portion of a circuit electrode to a bonding material in an environment at a first temperature, the bonding portion and the bonding material being used in an environment at a second temperature which is different from the first temperature, the method comprising the steps of:
A circuit electrode bonding apparatus comprising:
Dependencies are inferred from the claim text.