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US 2004/0069339 A1Published application
Thermoelectric cooler having first and second TEC elements with differing physical parameters
AssigneeAgere Systems Inc.
InventorYuZhong Dai
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Abstract
The present invention provides a thermoelectric cooler (TEC) In one embodiment, the TEC includes a first substrate and a second substrate. In addition, the TEC includes first and second TEC elements coupled to and between the first substrate and the second substrate. Moreover, the second TEC elements have a physical parameter different from the first TEC elements. A method of manufacturing a TEC and a laser pump module incorporating the TEC or the method are also disclosed.
Claims20
A thermoelectric cooler (TEC), comprising:
- a first substrate;
- a second substrate;
- and
- first and second TEC elements coupled to and located between said first substrate and said second substrate, said second TEC elements having a spatial relationship different from a spatial relationship of said first TEC elements.
1 more element
A method of manufacturing a thermoelectric cooler (TEC), comprising:
- providing first and second substrates;
- and
- coupling said first substrate to said second substrate with first and second TEC elements, said second TEC elements having a spatial relationship different from said first TEC elements.
A laser pump module, comprising:
- a laser generator mounted on a submount;
- and
- a thermoelectric cooler (TEC), coupled to said submount, including:
- a first substrate,
- a second substrate, and
- first and second TEC elements coupled to and located between said first substrate and said second substrate, said second TEC elements having a spatial relationship different from a spatial relationship of said first TEC elements wherein a distance between said second TEC elements ranges from about 1.0 mm to about 1.5 mm.
3 more elements
Dependencies are inferred from the claim text.