Device addressing gas contamination in a wet process
AssigneeMicron Technology, Inc.
InventorJ. Brett Rolfson
Life of this patent
Estimating the term…
Abstract
A device for wet processing of a semiconductor-containing substrate that addresses contamination in the wet process by removing undesired sources of gas contamination, the method involving pumping a processing liquid through a degasifier, exposing the semiconductor wafer, in a vessel, to the degasified processing liquid; and optionally recirculating the processing liquid through the degasifier and back into the vessel.
Claims33
A wet process system, comprising:
- an in-fab degasifier;
- a process tank in fluid communication with said in-fab degasifier;
- and
- an overflow tank in fluid communication with said process tank and with said in-fab degasifier.
A cleanroom liquid recirculation apparatus, comprising:
- a vessel configured to hold a semiconductor workpiece and to receive a processing fluid;
- a tank in fluid communication said vessel and configured to receive said processing fluid and a gas within said processing fluid;
- and
- a gas-remover coupled to said tank and said vessel and configured to receive said processing fluid and said gas from said tank and further configured to return said processing fluid to said vessel.
A wet bench, comprising:
- wet-process chemical circulation apparatus;
- and
- a degasifier coupled to said wet-process chemical circulation apparatus.
A semiconductor processor, comprising:
- a post-gasification tank;
- a liquid-degasifying apparatus coupled to said post-gasification tank and within a point-of-use area for a wafer;
- and
- a post-degasification tank coupled to said liquid-degasifying apparatus and in fluid communication with said post-gasification tank, wherein said post-degasification tank is configured to have said wafer therein.
A device in a semiconductor fabrication edifice, comprising:
- a processing apparatus configured to hold a semiconductor workpiece;
- a first conduit configured to carry a liquid and a gas away from said processing apparatus;
- a degasifier coupled to said first conduit;
- and
- a second conduit coupled to said degasifier and said processing apparatus, wherein said second conduit is configured to carry said liquid from said degasifier to said processing apparatus.
A method of processing a semiconductor workpiece, comprising:
- receiving a liquid into a fab;
- introducing said liquid to said workpiece;
- and
- passing said liquid through a degasifier after said step of introducing said liquid to said workpiece.
A method of circulating a processing fluid, comprising:
- exposing said fluid to an atmosphere within a semiconductor fabrication facility;
- directing said fluid from said atmosphere to a degasifier;
- and
- directing said fluid from said degasifier to a workpiece.
A process for treating a semiconductor workpiece, comprising:
- supplying a chemical to a wet processing system;
- allowing an introduction of a product of an atmospheric reaction into said chemical;
- removing said product from said chemical;
- and
- exposing said workpiece to said chemical.
A method of regulating a treatment system for a semiconductor workpiece, comprising:
- introducing a liquid into said treatment system;
- allowing a chemical reaction to occur within said treatment system;
- exposing said liquid to a constituent formed from said chemical reaction;
- removing said constituent from said liquid;
- and
- directing said liquid toward said semiconductor workpiece.
A method of reducing gas contamination in a recirculation bath liquid, comprising:
- permitting a gas to dissolve into said liquid after a first treatment of a semiconductor workpiece with said liquid;
- and
- removing said gas from said liquid before a second treatment of said semiconductor workpiece with said liquid.
A method of controlling exposure of a process liquid to a semiconductor wafer, comprising:
- bringing said process liquid into a fabrication environment;
- allowing said process liquid to gasify in said fabrication environment;
- and
- degasifying said process liquid before an exposure of said process liquid to said wafer.
A method of regulating gas contamination in a semiconductor fabrication housing, comprising:
- allowing a first gas within said semiconductor fabrication housing to contact a liquid;
- separating said first gas from said liquid;
- and
- exposing said liquid to a workpiece.
Dependencies are inferred from the claim text.