Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces

A method for processing substrate, comprising:

• applying a first fluid onto a surface of a substrate;
• applying a second fluid onto the surface of the substrate, the second fluid being applied in close proximity to the application of the first fluid;
• and
• removing the first fluid and the second fluid from the surface of the substrate, the removing being processed just as first fluid and the second fluid are applied to the surface of the substrate;
• wherein the applying and the removing forming a controlled meniscus.

A substrate preparation apparatus to be used in substrate processing operations, comprising:

• a proximity head being configured to move toward a substrate surface, the proximity head including,
• at least one of a first source inlet, the first source inlet being configured to apply a first fluid towards the substrate surface when the proximity head is in a position that is close to the substrate surface,
• at least one of a second source inlet, the second source inlet being configured to apply a second fluid towards the substrate surface when the proximity head is in the position that is close to the substrate surface, and
• at least one of a source outlet, the source outlet being configured to apply a vacuum pressure to remove the first fluid, the second fluid from the substrate surface when the proximity head is in the position that is close to the substrate surface.

A substrate preparation apparatus to be used in substrate processing operations, comprising:

• a proximity head carrier assembly configured to travel in a linear movement along a radius of a substrate, the proximity head carrier assembly including,
• a first proximity head being disposed over a substrate;
• a second proximity head being disposed under the substrate;
• an upper arm connected with the first proximity head, the upper arm being configured so the first proximity head is movable into close proximity over the substrate to initiate substrate preparation;
• and
• a lower arm connected with the second proximity head, the lower arm being configured so the second proximity head is movable into close proximity under the substrate to initiate substrate preparation.