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US 2004/0069319 A1Published application
Method and apparatus for cleaning a substrate using megasonic power
AssigneeLam Research Corporation
InventorsJohn M. Boyd, Mike Ravkin, Fred C. Redeker, John de Larios
Life of this patent
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Abstract
A method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.
Claims20
A method for processing a substrate, comprising:
- generating a fluid meniscus on a surface of the substrate;
- applying acoustic energy to the fluid meniscus;
- and
- moving the fluid meniscus over the surface the substrate to process the surface of the substrate.
1 more element
A head used in a substrate preparation apparatus, comprising:
- at least one of a first source inlet for delivering a first fluid to the surface of the substrate through the head;
- at least one of a second source inlet for delivering a second fluid to the surface of the substrate through the head, the second fluid being different than the first fluid;
- and
- at least one of a source outlet for removing each of the first fluid and the second fluid from the surface of the substrate, at least a portion of the at least one of the source outlet being located in between the at least one of the first source inlet and the at least one of the second source inlet, and the at least one of the first source inlet, the at least one of the second source inlet, and the at least one of the source outlet being configured to act substantially simultaneously when in operation;
- and
- a transducer being capable of applying acoustic energy to the first fluid;
- wherein the at least one of the second source inlet surrounds at least a trailing edge side of the at least one of the source outlet.
4 more elements
A manifold for use in preparing a wafer surface, comprising:
- a cleaning region in a first portion of the manifold being configured generate a first fluid meniscus on the wafer surface;
- a transducer being defined within the cleaning region capable of applying acoustic energy to the first fluid meniscus;
- and
- a drying region in a second portion of the manifold being configured to generate a second fluid meniscus on the wafer surface.
1 more element
Dependencies are inferred from the claim text.