# US 2004/0069017 A1 · Encapsulation of a display element and method of forming the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2004/0069017 A1
- Document ID: US20040069017A1
- Status: Published application
- Kind: A1
- Application number: 10/679,394
- Filed: 2003-10-07
- Published: 2004-04-15
- Earliest claimed: 2001-10-09
- Assignees: Delta Optoelectronics, Inc.
- Inventors: Chien-Hsing Li; Chun-Chien Chen; Jiun-Wei Tsai; Cheng-Nan Yeh; Lai-Cheng Chen
- Web page: https://patentgrep.com/patent/US20040069017A1

## CPC

- C03C 27/06: Joining glass to glass by processes other than fusing (fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66)
- H10K 59/8722: {Peripheral sealing arrangements, e.g. adhesives, sealants}
- H10K 59/8723: {Vertical spacers, e.g. arranged between the sealing arrangement and the OLED}
- H10K 59/8794: {Arrangements for heating and cooling}
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

A display element has a luminescent body formed on a glass substrate, a glass cap with the rim bonded to the rim of the glass substrate, and a sealing layer of frit formed on the bonding region between the glass substrate and the glass cap. In encapsulating, the display element is placed between a pedestal an a pressing plate, and then a high-power laser beam is provided to penetrate the glass cap to focus on the sealing layer, resulting in sintering frit. Also, pressure is applied to the pedestal and the pressing plate.

## Claims

### Claim 1

A method of encapsulating a display element, comprising steps of:
providing an organic light emitting diode or a plastic light emitting diode, comprising a luminescent body formed on a glass substrate and a glass cap with a rib structure formed on the bottom surface thereof;
coating a sealing layer of frit on the rim of the glass cap and surrounding the rib structure;
providing a pedestal on which the display element is placed;
providing a pressing plate disposed on the display element;
providing a high-power beam penetrating the glass cap to focus on the sealing layer so as to sinter the frit; and
applying pressure on the pedestal and the pressing plate.

### Claim 2 (depends on 1)

The method of encapsulating a display element according to claim 1, wherein the pedestal and the pressing plate are of metal materials with good thermal conductivity.

### Claim 3 (depends on 1)

The method of encapsulating a display element according to claim 1, wherein the high-power beam is a laser beam.

### Claim 4 (depends on 1)

The method of encapsulating a display element according to claim 1, wherein the laser beam has a wavelength exceeding 550 nm.

### Claim 5 (depends on 1)

The method of encapsulating a display element according to claim 1, wherein the high-power beam is an infrared ray.

### Claim 6 (depends on 1)

The method of encapsulating a display element according to claim 1, wherein the infrared ray has a wavelength exceeding 800 nm.

### Claim 7 (depends on 1)

The method of encapsulating a display element according to claim 1, wherein the rib structure is frit.

### Claim 8 (depends on 1)

The method of encapsulating a display element according to claim 1, wherein the rib structure is of ceramic materials.

### Claim 9 (depends on 1)

The method of encapsulating a display element according to claim 1, wherein the luminescent body is laminated with at least an anode layer, an organic luminescent layer and a cathode layer.