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US 2004/0062887 A1Published application
Metallic board
AssigneeDOT Packaging Group, Inc.
InventorsJohn W. Quinn, Jack A. Fuechsl
Life of this patent
Estimating the term…
Abstract
A blister board and a blister package wherein the board and package includes a metallized paper so that the blister material is securely bonded to both the metallized paper and to the underlying paper board material.
Claims14
A board for a blister package comprising:
- a layer of paper;
- and
- a layer of metallized paper secured to said paper layer.
A-blister package comprising:
- a layer of paper;
- a layer of metallized paper secured to said paper layer;
- and
- a blister secured to said metallized paper and said paper layer.
1 more element
A blister package comprising:
- a layer of paper;
- a blister bonded to said paper;
- and
- a metallized layer of paper located between said layer of paper and said blister.
1 more element
Dependencies are inferred from the claim text.