Semiconductor integrated circuit
AssigneeNEC Corporation
InventorYasushi Kinoshita
Life of this patent
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Abstract
A semiconductor integrated circuit comprising a power supply wiring and a ground wiring and a decoupling capacitor formed between the power supply wiring and the ground wiring, wherein at least one electrode of the decoupling capacitor consists of a shield layer formed in a plane shape on a semiconductor substrate, and the shield layer is electrically connected directly to the semiconductor substrate and is fixed to a power supply potential or the ground potential.
Claims6
A semiconductor integrated circuit comprising a power supply wiring and a ground wiring and a decoupling capacitor formed between said power supply wiring and said ground wiring, wherein at least one of the electrodes of said decoupling capacitor consists of a shield layer formed in a plane shape on a semiconductor substrate, and said shield layer is connected electrically directly to the semiconductor substrate and is fixed to a power supply potential or the ground potential.
A semiconductor integrated circuit comprising a power supply wiring and a ground wiring and a decoupling circuit formed between said power supply wiring and said ground wiring, wherein at least one electrode of said decoupling capacitor consists of a shield layer obtained by covering a plurality of protrusions formed on a semiconductor substrate, and said shield layer is electrically connected directly to the semiconductor substrate and is fixed to a power supply potential or the ground potential.
Dependencies are inferred from the claim text.