US 2004/0062002 A1Published application

High density modular input/output package in a data processing system

AssigneeInternational Business Machines Corporation

InventorsDennis R. Barringer, Philip M. Corcoran, William P. Kostenko, Edward J. Seminaro

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Abstract

An I/O subsystem for providing a high density modular input/output package in a data processing system. The I/O subsystem includes an enclosure having a midplane assembly in the center portion. The enclosure includes electrical components including redundant power supplies, air moving units and DASD carriers having DASD drives assemblies therein in the front portion of the enclosure, and planar boards having PCI card assemblies slidably mounted thereon in the rear portion of the enclosure. The mid plane includes multiconductor power buses for distribution of power from the power supplies to the electrical components of the I/O subsystem.

An I/O subsystem for a data processing system comprising:

an enclosure having a central portion, and front portion and a rear portion;
a midplane in said central portion of said enclosure, said mid plane having forwardly connectors facing toward said front portion of said enclosure and backwardly facing connectors facing toward said rear portion of said enclosure;
a horizontal stiffener in said front portion dividing said front portion into a top and a bottom;
at least one power supply module slidably located in the bottom of said front portion, said power supply module having connectors connected to forwardly facing connectors in said midplane;
at least one air moving device slidably located in the top of said front portion, said air moving device having a connector connected to a forwardly facing connector in said midplane;
at least one DASD carrier slidably located in said top of said front portion, said DASD carrier having a backplane with connectors for hot plugging into forwardly facing connectors above said midplane;
at least one DASD drive assembly slidably located in one of said DASD carriers, said DASD drive assembly having a connector connected to the hot plugging connectors of said DASD backplane;
at least one planar board slidably located in the rear portion of said enclosure, said planar board having connectors connected to backwardly facing connectors in said midplane and a plurality of rails connectors;
at least one PCI card assembly slidably engaged with one of the rail connectors and having a latch for making a hot plug electrical connection between the PCI card assembly and the rail connector and latching said PCI card assembly to the rail connector;
and
multiconductor power buses in said midplane for distributing power from said power supply to said air moving device, said DASD carrier and DASD drive assemblies in the DASD carrier, and said planar card and PCI card assemblies connected to said planar card.

8 more elements

Facts

Application

10/256,605Filed 27 Sep 2002

Published

1 Apr 2004

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

H05K 7/20727
Forced ventilation of a gaseous coolant: within server blades for removing heat from heat source
G06F 1/18
Constructional details or arrangements: packaging or power distribution
G06F 1/20
Constructional details or arrangements: cooling means
H05K 7/1461
Mounting supporting structure in casing or on frame or rack: slidable card holders; Card stiffeners; Control or display means therefor

Abstract

Claims11