Stripline parallel-series-fed proximity-coupled cavity backed patch antenna array
AssigneeAndrew Corporation
InventorJoel C. Roper
Life of this patent
Estimating the term…
Abstract
An antenna array having one or more multi-layer substrates each including top and bottom ground planes and an inner conductive layer, a plurality of proximity coupled cavity backed patch antenna elements formed by each multi-layer substrate, and distribution traces extending along the inner conductive layer of the substrates and coupling with the proximity coupled cavity backed patch antenna elements.
Claims41
An antenna array comprising:
- a plurality of multi-layer substrates coupled to one another in a co-planar array, each including top and bottom ground planes and an inner conductive layer;
- a plurality of proximity coupled cavity backed patch antenna elements disposed on the plurality of multi-layer substates, each proximity coupled cavity back patch antenna element including plated through holes connecting the top and bottom ground planes of a multi-layer substrate around an element perimeter;
- and
- a plurality of distribution traces extending along the inner conductive layer of the substrates and coupling with the proximity coupled cavity backed patch antenna elements.
An antenna array comprising:
- multi-layer substrate, including top and bottom ground planes and an inner conductive layer;
- a plurality of proximity coupled cavity backed patch antenna elements disposed on the multi-layer substrate, each proximity coupled cavity back patch antenna element including plated through holes connecting the top and bottom ground planes around an element perimeter;
- and
- at least one distribution trace extending along the inner conductive layer of the substrate and coupling with the proximity coupled cavity backed patch antenna elements.
A multi-layer substrate, comprising:
- a top ground plane;
- a bottom ground plane;
- an inner conductive layer;
- a plurality of proximity coupled cavity backed patch antenna elements, each proximity coupled cavity backed patch antenna element including plated through holes connecting the top and bottom ground planes around an element perimeter;
- and
- a distribution trace extending along the inner conductive layer of the substrate and coupling with the antenna elements.
A method of forming a multi-layer substrate for use in an antenna array, the method comprising:
- forming a top ground plane;
- etching patch radiating elements from the top ground plane;
- forming a bottom ground plane;
- connecting the top and bottom ground planes around a plurality of element perimeters to form a plurality of proximity coupled cavity backed patch antenna elements;
- and
- forming distribution traces extending along an inner conductive layer and coupling with the antenna elements.
A method of forming an antenna array, the method comprising:
- forming a plurality of multi-layer substrates, including, for each multi-layer substrate;
- forming a top ground plane;
- etching patch radiating elements from the top ground plane;
- forming a bottom ground plane;
- connecting the top and bottom ground planes around a plurality of element perimeters to form a plurality of proximity coupled cavity backed patch antenna elements;
- and
- forming distribution traces extending along an inner conductive layer and coupling with the antenna elements;
- and,
- electrically coupling the plurality of multi-layer substrates to one another.
Dependencies are inferred from the claim text.