US 2004/0061512 A1 · Testing method for electronic component and testing device

Abstract

A testing method for an electronic component in which a predetermined load is set, which is determined by a burn-in temperature, a burn-in voltage, and a burn-in period of time, and burn-in of an electronic component is carried out in such a manner that a load equal to the predetermined load is applied to the electronic component, with the method including a first step of placing an electronic component having a negative resistance-temperature characteristic in a heating atmosphere so that the temperature of the electronic component reaches a predetermined temperature which is lower than the burn-in temperature, a second step of supplying constant current to flow through the electronic component so that the predetermined temperature of the electronic component is increased to the burn-in temperature, and a third step of comparing the voltage actually applied to the electronic component to the burn-in voltage, correcting the burn-in time-period based on the comparison to determine a corrected burn-in time-period, and applying constant current to flow through the electronic component based on the corrected burn-in time-period.

Claims20

Dependent claims

A method of testing an electronic component in which a predetermined load is set, which predetermined load is determined by a burn-in temperature, a burn-in voltage, and a burn-in period of time, and burn-in of the electronic component is carried out in such a manner that a load equal to the predetermined load is applied to the electronic component, the method comprising the steps of:

a first step of placing the electronic component having a negative resistance-temperature characteristic in a heating atmosphere such that the electronic component reaches a predetermined temperature, said predetermined temperature being lower than the burn-in temperature;
a second step of supplying constant current to flow through the electronic component so that the predetermined temperature of the electronic component is controlled to be increased to the burn-in temperature;
and
a third step of comparing the voltage actually applied to the electronic component to the burn-in voltage, correcting the burn-in time-period based on the comparison to determine a corrected burn-in time-period, and applying constant current to flow through the electronic component based on the corrected burn-in time-period.

1 more element

A testing device with which a predetermined load is set, which is determined by a burn-in temperature, a burn-in voltage, and a burn-in time-period, and the burn-in of the electronic component is carried out in such a manner that a load that is equal to the predetermined load is applied to the electronic component, the testing device comprising:

a constant current source unit which supplies constant current to flow through the electronic component;
and
a burn-in control unit for controlling the operation of the constant current source unit;
the burn-in control unit carrying out at least a temperature-increasing process during which the control unit drives the constant current source unit so that constant current flows through the electronic component, and thereby, the temperature of the electronic component is increased from a predetermined temperature to the burn-in temperature, and a burn-in controlling step at which the voltage actually applied to the electronic component is compared with the burn-in voltage, correction-calculation of the burn-in time-period is carried out based on comparison results, and the burn-in of the electronic component is carried out at the burn-in temperature in compliance with the corrected burn-in time-period.

1 more element

Dependencies are inferred from the claim text.

Testing method for electronic component and testing device

Life of this patent

Testing method for electronic component and testing device

Life of this patent

Abstract

Claims20