Light emitting apparatus and method of manufacturing the same

A method of manufacturing a light emitting apparatus comprising a light emitting device disposed on a supporting body;

• a fluorescent substance that absorbs at least a portion of light emitted from said light emitting device and emits light of a different wavelength;
• and a coating layer that includes said fluorescent substance and covers at least the surface of said light emitting device, the method comprising:
• a first step of preparing a coating solution that contains an organometallic compound including at least one element selected from the group consisting of Si, Al, Ga, Ti, Ge, P, B, Zr, Y, Sn, Pb and alkali earth metals;
• an organic solvent;
• and a fluorescent substance;
• a second step of applying said coating solution onto the surface of said light emitting device and the surface of said supporting body;
• and
• a third step of drying said coating solution so as to fix said fluorescent substance.

A method of manufacturing a light emitting apparatus having a supporting substrate;

• a light emitting device consisting of gallium nitride-based compound semiconductor layers formed on a substrate, said light emitting device being disposed so that the substrate-side surface of said light emitting device opposes the top surface of said supporting body via an adhesive layer, the method comprising:
• a first step of preparing an adhesive solution that contains an organometallic compound containing at least one element selected from the group consisting of Si, Al, Ga, Ti, Ge, P, B, Zr, Y, Sn, Pb and alkali earth metals, and an organic solvent, so as to obtain a hydrolyzed solution having viscosity in a range from 2.5 to 500 cps at 25° C. and acid concentration in a range from 20 to 500 ppm;
• a second step of applying the adhesive solution to the top surface of said supporting body and placing said light emitting device on the adhesive solution;
• and
• a third step of drying the adhesive solution at a temperature in a range from 50° C. to 300° C. so as to bond the top surface of said supporting body and the substrate-side surface of said light emitting device.