System and method for performing simultaneous precision die bond of photonic components onto a single substrate
AssigneeIntel Corporation
InventorDale L. Capewell
Life of this patent
Estimating the term…
Abstract
Embodiments of the present invention overcome the disadvantages of the metal bond head systems while also providing a method for performing precision die bond of multiple die at once. A mounting system is adapted for simultaneous high accuracy placement of multiple semiconductor components or dies on substrates. Simultaneous high accuracy multiple die placement is achieved by providing a mounting head assembly, including a see-through (ST) bond head with selectively and independently controlled gripping mechanisms, with moving and/or adjusting mechanisms adapted for accurate alignment of semiconductor components relative to a substrate in all directions.
Claims30
An apparatus adapted for gripping a plurality of objects, the apparatus comprising:
- a mounting head;
- a plurality of suction-operated gripping mechanisms for selectively and independently gripping a plurality of objects positioned adjacent to said gripping mechanisms;
- a suction-operated attachment mechanism for attaching said plurality of gripping mechanisms to said mounting head;
- a viewing mechanism, including a first camera, for viewing the plurality of objects gripped by said plurality of gripping mechanisms, said plurality of gripping mechanisms having a light-transmitting portion positioned in such a manner that objects gripped by said plurality of gripping mechanisms can be viewed by said first camera through said plurality of gripping mechanisms.
A see-through bond head adapted for gripping a plurality of objects, the see-through bond head comprising:
- a light transmitting vacuum transfer plate;
- a plurality of suction-operated gripping mechanisms for selectively and independently gripping a plurality of objects positioned adjacent to said gripping mechanisms, said plurality of gripping mechanisms having a light-transmitting portion positioned in such a manner that objects gripped by said plurality of gripping mechanisms can be viewed by a camera through said plurality of gripping mechanisms;
- and
- a suction-operated attachment mechanism for selectively and independently gripping the plurality of objects positioned adjacent to said gripping mechanisms.
A method of manufacturing a wavelength division multiplexing system, comprising:
- examining the fiducials on a see-through bond head and the fiducials on a photonic component;
- comparing the position of the fiducials on the see-through bond head and the fiducials on the photonic component;
- aligning the photonic component relative to the see-through bond head;
- loading serially a plurality of photonic components onto the see-through bond head;
- aligning the serially loaded plurality of photonic components relative to a substrate;
- placing the serially loaded plurality of photonic components onto the substrate in one step;
- and
- curing an epoxy to bond the serially loaded plurality of photonic components onto the substrate.
Dependencies are inferred from the claim text.