Chip seal method with heating step
AssigneeManhole Adjusting Contractors Inc.
InventorJohn Corcoran
Life of this patent
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Abstract
A paving method is provided that includes applying a thermoplastic material to a surface to be paved, covering the thermoplastic material with a layer of aggregate (precoated or otherwise), passing a heater above the aggregate and thermoplastic material, and at least partially embedding the aggregate in the thermoplastic material.
Claims29
A paving method comprising:
- applying a thermoplastic material to a surface to be paved;
- covering the thermoplastic material with a layer of aggregate;
- passing a heater above the aggregate and thermoplastic material;
- and
- at least partially embedding the aggregate in the thermoplastic material.
2 The method of claim 1, wherein the heater heats the thermoplastic material at least to its softening point.
3 The method of claim 1, wherein the heater heats the thermoplastic material to a temperature of at least about 140° Fahrenheit.
A paving method comprising:
- applying a thermoplastic material to a surface to be paved;
- covering the thermoplastic material with a layer of aggregate, precoated or otherwise;
- passing a heater above the aggregate and thermoplastic material to indirectly heat the thermoplastic material;
- heating the thermoplastic material at least to its softening point;
- and
- passing a roller(s) over the aggregate to at least partially embed the aggregate in the thermoplastic material.
Dependencies are inferred from the claim text.