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AssigneeSharp Kabushiki Kaisha
InventorShuichi Hirukawa
Estimating the term…
Immediately after stacking of a barrier layer formed of GaAsP of a multiple-strain quantum well active layer 105 at a growth temperature of 650° C., a second upper guide layer 126 formed of AlGaAs is stacked. This second upper guide layer 126 is grown while the temperature is kept at 650° C., which is a growth temperature suitable for P-based layers. By reducing the desorption of P from the barrier layer, the roughness level of the interface between the barrier layer and the second upper guide layer 126 is lowered to 20 Å or less. Thereafter, a first upper guide layer 106 is stacked. Growth temperature of this first upper guide layer 106, which is 650° C. at a start of the growth, is started to be increased concurrently with the growth, and gradually elevated until an end of the growth so as to reach 750° C. at the end of the growth.
A semiconductor laser device including, on a GaAs substrate, at least a first-conductive-type lower cladding layer, a lower guide layer, a quantum well active layer composed of at least one well layer and at least two barrier layers, an upper guide layer and a second-conductive-type upper cladding layer, one on another, wherein
A method for manufacturing a semiconductor laser device including, on a GaAs substrate, at least a first-conductive-type lower cladding layer, a lower guide layer, a quantum well active layer composed of at least one well layer and at least two barrier layers, an upper guide layer and a second-conductive-type upper cladding layer, one on another, wherein
Dependencies are inferred from the claim text.