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AssigneeHewlett-Packard Development Company, L.P.
InventorsDaniel L. Callahan, Raymond J. Iannuzzelli
Estimating the term…
The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.
A device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor, comprising:
A method for limiting shock/vibrational motion of a microprocessor comprising placing a dynamic isolating mount between a processor and printed wiring board.
A method for preventing cracking of the ceramic body of a microprocessor comprising placing a dynamic isolating mount on a printed wiring board where said printed wiring board contacts said processor.
A computer system comprising:
Dependencies are inferred from the claim text.