Composite construction baffle for modular electronic systems
AssigneeHewlett-Packard Development Company, L.P.
InventorsJeremy I. Wilson, Todd D. Robertus, Steven R. Hahn, Michael A. Brooks
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Abstract
The present invention provides a baffle for use with an electronic system including a wall, a first edge guide, and a second edge guide. The wall has a first edge and a second edge opposite the first. The first edge guide is connected to the wall and extends beyond the first edge of the wall. The second edge guide is connected to the wall and extends beyond the second edge of the wall. The first edge guide and the second edge guide are adapted to selectively associate with a first card guide and a second card guide of the modular electronic system. The baffle is adapted to manage airflow within the modular electronic system.
Claims25
A baffle for a modular electronic system, the baffle comprising:
- a wall having a first edge and a second edge opposite the first edge;
- a first edge guide connected to the wall and extending beyond the first edge;
- and
- a second edge guide connected to the wall and extending beyond the second edge;
- wherein the first edge guide and the second edge guide are adapted to selectively associate with a first card guide and a second card guide of the modular electronic system, and the baffle is adapted to manage airflow within the modular electronic system.
A modular electronic system comprising:
- a housing including a first card guide and a second card guide opposite the first card guide;
- a heat generating cell board extending between and selectively maintained by the first card guide and the second card guide;
- a baffle spaced from the cell board and adapted to direct airflow towards the cell board, the baffle including:
- a wall having a first edge and a second edge opposite the first edge;
- a first edge guide connected to the wall and extending beyond the first edge, the first edge guide being selectively received by the first card guide, and
- a second edge guide connected to the wall and extending beyond the second edge, the second edge guide being selectively received by the second card guide.
A method of cooling a modular electronic system including a housing having a first card guide and a second card guide opposite the first card guide;
- and a heat generating cell board extending between and selectively maintained by the first card guide and the second card guide, the method comprising:
- installing a baffle in the housing, the baffle including:
- a wall having a first edge and a second edge opposite the first edge,
- a first edge guide connected to the wall and extending beyond the first edge, the first edge guide being selectively received by the first card guide, and
- a second edge guide connected to the wall and extending beyond the second edge, the second edge guide being selectively received by the second card guide;
- and
- routing air through the housing including utilizing the baffle to direct air over the heat generating cell board to cool the heat generating cell board.
A method of cooling a modular electronic system including a housing having a first card guide and a second card guide opposite the first card guide;
- and a heat generating cell board extending between and selectively maintained by the first card guide and the second card guide, the method comprising:
- routing air through the housing including utilizing a baffle to direct air over the heat generating cell board to cool the heat generating cell board, the baffle including:
- a wall having a first edge and a second edge opposite the first edge,
- a first edge guide connected to the wall and extending beyond the first edge, the first edge guide being selectively received by the first card guide, and
- a second edge guide connected to the wall and extending beyond the second edge, the second edge guide being selectively received by the second card guide.
Dependencies are inferred from the claim text.