Thin type camera module
AssigneeInternational Semiconductor Technology Ltd.
InventorsCharles Yang, Allen Kuo
Life of this patent
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Abstract
A thin type camera module includes a fixing board, an imaging-sensing semiconductor assembly, and a lens holder. The image-sensing semiconductor assembly is manufacture by a chip-on-film (COF) packaging method. The image-sensing semiconductor assembly comprises an image sensing chip and a COF wiring film, wherein the image sensing chip is flip-chip mounted on the COF wiring film. A photosensitive surface of the image sensing chip is corresponding to a window of the COF wiring film and disposed toward a light-pervious channel of the lens holder. The lens holder is connected with the fixing board to form an airtight space for sealing the image sensing chip. The COF wiring film has a module circuit for mounting an electrical device.
Claims15
A thin type camera module comprising:
- a fixing board;
- an imaging-sensing semiconductor assembly comprising a COF (chip-on film) wiring film and an image sensing chip, wherein the COF wiring film has a surface, a window and a plurality of connecting ends disposed on the surface of the COF wiring film around the window, the image sensing chip has a photosensitive surface corresponding to the window, and a plurality of bumps are formed on peripherals of the photosensitive surface, the image sensing chip is flip-chip mounted on the COF wiring film to electrically connect the bumps with the connecting ends;
- and
- a lens holder for connecting a camera lens, wherein the lens holder has a light-pervious channel and is connected with the fixing board to form a airtight space for sealing the image sensing chip, and the photosensitive surface of the image sensing chip is corresponding to the light-pervious channel for capturing image.
Dependencies are inferred from the claim text.