Semiconductor device

A semiconductor device comprising:

• a seal member formed of an insulating member;
• a tab whose back side is exposed to a mounting surface of the seal member, the tab having, on a surface thereof opposite to the back side, a semiconductor element fixing area and wire connection areas;
• tab suspension leads exposed to the mounting surface of the seal member and contiguous to the tab;
• a plurality of leads whose back sides are exposed to the mounting surface of the seal member;
• a semiconductor element positioned within the seal member and fixed through an adhesive onto the semiconductor element fixing area on the surface of the tab in such a manner that a back side thereof is opposed to the tab surface;
• a plurality of electrodes formed on a main surface of the semiconductor element;
• electrically conductive wires for electrically connecting the plural electrodes and surfaces of the leads with each other;
• and
• electrically conductive wires for electrically connecting the electrodes on the semiconductor element and the wire connection areas on the tab with each other,
• wherein the tab is formed larger than the semiconductor element;
• and
• wherein a plating film is formed selectively on the wire connection areas and the surfaces of the leads and the wires are connected onto the plating film.

A semiconductor device comprising:

• a seal member formed of an insulating resin;
• a tab whose back side is exposed to a mounting surface of the seal member, the tab having, on a surface thereof opposite to the back side, a semiconductor element fixing area and wire connection areas;
• tab suspension leads exposed to the mounting surface of the seal member and contiguous to the tab;
• a plurality of leads whose back sides are exposed to the mounting surface of the seal member;
• a semiconductor element positioned within the seal member and fixed through an adhesive onto the semiconductor element fixing area on the surface of the tab in such a manner that a back side thereof is opposed to the tab surface;
• a plurality of electrodes formed on a main surface of the semiconductor element;
• electrically conductive wires for electrically connecting the plural electrodes and surfaces of the leads with each other;
• and
• electrically conductive wires for electrically connecting the electrodes on the semiconductor element and the wire connection areas on the tab with each other,
• wherein the tab is formed larger than the semiconductor element;
• and
• wherein grooves are formed in the surfaces of the leads respectively and the wires are connected at positions closer to the semiconductor element with respect to the grooves formed in the surfaces of the leads.

A semiconductor device comprising:

• a semiconductor element;
• a tab with the semiconductor element fixed to a surface thereof;
• a plurality of leads formed in a mutually independent manner so that inner ends thereof are positioned close to peripheral edges of the tab;
• wires for electrically connecting electrodes on the semiconductor element and the inner ends of the leads with each other;
• wires for electrically connecting the electrodes on the semiconductor element and the tab with each other;
• and
• a seal member formed of an insulating resin, the seal member being formed so as to cover the semiconductor element, the tab, the wires and the inner end sides of the leads,
• wherein the tab is formed larger than the semiconductor element so that outer peripheral edges thereof are positioned outside outer peripheral edges of the semiconductor element;
• wherein a groove is formed in the surface of the tab so as to be positioned between a semiconductor element fixing area to which the semiconductor element is fixed and wire connection areas to which the wires are connected;
• and
• wherein a plating film is formed selectively on wire-connecting surfaces areas of the tab and the leads and the wires are connected onto the plating film.

A semiconductor device comprising:

• a seal member formed of an insulating resin;
• a tab whose back side is exposed to a mounting surface of the seal member, the tab having, on a surface thereof opposite to the back side, a semiconductor element fixing area and wire connection areas;
• tab suspension leads exposed to the mounting surface of the seal member and contiguous to the tab;
• a plurality of leads whose back sides are exposed to the mounting surface of the seal member;
• a semiconductor element positioned within the seal member and fixed through an adhesive onto the semiconductor element fixing area on the surface of the tab in such a manner that a back side thereof is opposed to the tab surface;
• a plurality of electrodes formed on a main surface of the semiconductor element;
• electrically conductive wires for electrically connecting the plural electrodes and surfaces of the leads with each other;
• and
• electrically conductive wires for electrically connecting the electrodes on the semiconductor element and the wire connection areas on the tab with each other,
• wherein the tab is formed larger than the semiconductor element so that outer peripheral edges of the tab are positioned outside outer peripheral edges of the semiconductor element;
• wherein a recess larger than the semiconductor element is formed in the surface of the tab;
• wherein the semiconductor element fixing area is positioned within the recess;
• and
• wherein the semiconductor element is fixed to a bottom of the recess through an adhesive.

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) providing a lead frame, the lead frame comprising a plurality of lead portions, a tab having a semiconductor element fixing area and wire connection areas, a plurality of tab suspension leads contiguous to the tab, a groove portion formed between the semiconductor element fixing area and the wire connection areas, and a frame portion which connects the plural lead portions and the plural tab suspension leads with each other;
• (b) mounting a semiconductor element onto the semiconductor element fixing area through an adhesive;
• (c) electrically connecting through bonding wires between the semiconductor element and the plural lead portions and also between the semiconductor element and the wire connection areas;
• (d) forming a resin seal member which seals the semiconductor element and the bonding wires and which partially covers the tab, the plural tab suspension leads and the plural lead portions so that back sides of the tab, the plural tab suspension leads and the plural lead portions are exposed to a mounting surface side of the resin seal member;
• and
• (e) separating the plural lead portions and the plural tab suspension leads from the frame portion.

A semiconductor device comprising:

• a seal member formed of an insulating resin;
• a tab whose back side is exposed to a mounting surface of the seal member, the tab having, on a surface thereof opposite to the back side, a semiconductor element fixing area and wire connection areas;
• tab suspension leads exposed to the mounting surface of the seal member and contiguous to the tab;
• a plurality of leads whose back sides are exposed to the mounting surface of the seal member;
• a semiconductor element positioned within the seal member and fixed through an adhesive onto the semiconductor element fixing area on the surface of the tab in such a manner that a back side thereof is opposed to the tab surface;
• a plurality of electrodes formed on a main surface of the semiconductor element;
• electrically conductive wires for electrically connecting the plural electrodes and surfaces of the leads with each other;
• and
• electrically conductive wires for electrically connecting the electrodes on the semiconductor element and the wire connection areas on the tab with each other,
• wherein the tab is formed larger than the semiconductor element so that outer peripheral edges of the tab are positioned outside outer peripheral edges of the semiconductor element;
• and
• wherein a slit which pierces the tab is formed partially in the tab portion positioned between the semiconductor element fixing area and the wire connection areas.

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) providing a lead frame, the lead frame comprising a plurality of lead portions, a tab having a semiconductor element fixing area and wire connection areas, a plurality of tab suspension leads contiguous to the tab, a slit, or a slit and a groove contiguous thereto, the slit or the slit and the groove contiguous thereto being formed between the semiconductor element fixing area and the wire connection areas, and a frame portion which connects the plural lead portions and the plural tab suspension leads with each other;
• (b) mounting a semiconductor element onto the semiconductor element fixing area through an adhesive;
• (c) electrically connecting through bonding wires between the semiconductor element and the plural lead portions and also between the semiconductor element and the wire connection areas;
• (d) forming a resin seal member which seals the semiconductor element and the bonding wires and which partially covers the tab, the plural tab suspension leads and the plural lead portions so that back sides of the tab, the plural tab suspension leads and the plural lead portions are exposed to a mounting surface side of the resin seal member;
• and
• (e) separating the plural lead portions and the plural tab suspension leads from the frame portion.