Solid state gamma camera module and integrated thermal management method thereof

A solid state gamma camera module for providing a low thermal resistance path between integrated circuits and a heat sink interface while reducing a heat conduction path to temperature sensitive material, comprising:

• a printed circuit board having a first thermal layer and a second thermal layer, said first thermal layer being thermally and/or electrically bonded to said second thermal layer;
• a semiconductor detector module having said temperature sensitive material operable to electrically connect with said second thermal layer;
• a plurality of said integrated circuits being electrically connected to said first thermal layer;
• and
• covering means electrically and thermally bonded to said first thermal layer and operable to cover said plurality of integrated circuits,
• wherein said first thermal layer extracts heat from said integrated circuits through said second thermal layer and said second thermal layer extracts heat from an integrated circuit interconnect.

An integrated thermal management method for providing a low thermal resistance path between integrated circuits and a heat sink interface while reducing a heat conduction path to temperature sensitive material, comprising the steps of:

• providing a printed circuit board with a first thermal layer and a second thermal layer, said first thermal layer thermally and/or electrically bonded to said second thermal layer;
• providing a semiconductor detector module with said temperature sensitive material operable to electrically communicate with said second thermal layer;
• providing a plurality of said integrated circuits with a bottom metal layer and wire bonds, said integrated circuits being electrically connected to said first thermal layer;
• and
• providing covering means electrically and thermally bonded to said first thermal layer, with said covering means covering said plurality of integrated circuits,
• wherein said first thermal layer extracts heat from said integrated circuits by direct interface to said bottom metal layer and said second thermal layer extracts heat from an integrated circuit interconnect.

An integrated thermal management method for providing a low thermal resistance path between integrated circuits and a heat sink interface while reducing a heat conduction path to temperature sensitive material, comprising the steps of:

• providing a printed circuit board with a first thermal layer and a second thermal layer, said first thermal layer thermally and/or electrically bonded to said second thermal layer;
• providing a semiconductor detector module with said temperature sensitive material operable to electrically communicate with said second thermal layer;
• providing a plurality of said integrated circuits electrically connected to said first thermal layer;
• and
• providing covering means electrically and thermally bonded to said first thermal layer, with said covering means covering said plurality of integrated circuits,
• wherein said first thermal layer extracts heat from said integrated circuits through said second thermal layer and said second thermal layer extracts heat from an integrated circuit interconnect.