Wafer backside electrical contact for electrochemical deposition and electrochemical mechanical polishing

An apparatus for electrochemically plating metal onto a substrate, comprising:

• a substrate support member having a substrate support surface formed thereon, the substrate support member being configured vacuum chuck a non-production side of the substrate to the substrate support surface and electrically engage non-production side of the substrate;
• plating bath positioned below the substrate support member, the plating bath being configured to contain an electrochemical plating solution and an anode therein;
• and
• a head assembly in mechanical communication with the substrate support member, the head assembly being configured actuate the substrate support member in at least one of horizontally, vertically, pivotally, and rotationally to support the substrate in a face down configuration in the plating bath.

A method for electrochemically plating metal onto a substrate, comprising:

• depositing a seed layer on a production surface of the substrate, the seed layer extending around a bevel edge of the substrate onto at least a portion of a non-production surface of the substrate;
• vacuum chucking the non-production surface of the substrate to a substrate support member;
• immersing the production surface of the substrate in an electrochemical plating solution having an anode positioned therein;
• and
• providing an electrical plating bias between the production surface of the substrate and the anode via electrically connecting the portion of the seed layer that extends onto at least a portion of the non-production surface with a cathode terminal of a power supply and electrically connecting the anode with an anode terminal of a power supply.