Falling film plasma reactor
OwnerRobert R. Mooreinventor
Life of this patent
Estimating the term…
Abstract
A falling film plasma reactor (FFPR) provides a number of benefits for the treatment of process gases. The falling film plasma reactor uses high voltage alternating current or pulsed direct current which is applied to radially separated electrodes to thereby create a dielectric breakdown of the process gas that is flowing within the large radial gap between the two electrodes. Typical plasma reactors often utilize fixed dielectric construction which can result in potential failure of the device by arcing between the electrodes as portions of the dielectric fail. Such failures are prevented by using a dielectric liquid that constantly flows over the electrodes, or over a fixed dielectric barrier over the electrodes.
Claims8
A method of operating a falling film plasma reactor comprising the step of flowing a liquid dielectric over the surface of a first electrode.
A falling film plasma reactor using high voltage alternating current or pulsed direct current applied to radially spaced cylindrical electrodes to generate dielectric breakdown of a process gas within a large radial gap comprising a first inner electrode having an outer surface, a second outer electrode having an inner surface, wherein said first inner electrode is configured to allow a liquid dielectric to flow as a film over said outer surface of said first inner electrode.
A falling film plasma reactor comprising radially spaced cylindrical electrodes, and a large radial gap between the electrodes configured to allow a dielectric liquid to flow over at least one of said electrodes, and further configured to allow a process gas to contact said liquid dielectric flowing over at least one of said electrodes.
Dependencies are inferred from the claim text.