Bladder based package control/singulation
AssigneeMicron Technology, Inc.
InventorDaniel P. Cram
Life of this patent
Estimating the term…
Abstract
An apparatus and method for singulating IC devices or semiconductor devices and/or components thereof. The apparatus includes a flexible membrane or bladder configured to receive an applied fluid pressure on a surface thereof and expand in response to the applied fluid pressure. Upon expansion of the flexible membrane, a semiconductor device or semiconductor device component is contacted by the flexible membrane and immobilized. The semiconductor device may then be subjected to a predetermined test or manufacturing operation. Subsequent any processing to the semiconductor device or component, the fluid pressure is released such that the flexible membrane contracts and releases the semiconductor device to be advanced for further processing, testing, or preparation for shipping.
Claims30
A semiconductor device handling apparatus comprising:
- a first plate having a first opening therethrough;
- a second plate having a first opening therethrough, the first opening of the second plate being substantially aligned with the first opening of the first plate;
- and
- a first flexible membrane disposed between the first and second plates for receiving a first fluid pressure adjacent the first opening of the first plate for causing said membrane to extend outwardly through the first opening of the second plate to immobilize at least one semiconductor device moving adjacent thereto.
A handling apparatus for handling IC components comprising:
- a first flexible membrane configured to receive an applied fluid pressure on a surface of the first flexible membrane and to expand to contact and immobilize at least one IC component moving adjacent thereto;
- and
- a second flexible membrane configured to receive an applied fluid pressure on a surface of the second flexible membrane and to expand to contact and immobilize at least one IC component moving adjacent to the second flexible membrane.
An IC device handler comprising:
- an input location for receiving a plurality of IC devices;
- a pathway along which the IC devices are advanced from the input location;
- a first flexible membrane to receive an applied fluid pressure on a surface thereof and to contact at least one of the plurality of IC devices to stop the advancement of the at least one of the plurality of IC devices;
- and
- a second flexible membrane configured to receive an applied fluid pressure on a surface thereof and to contact at least one of the plurality of IC devices to stop the advancement thereof.
An automated IC device handler comprising:
- an input location for receiving a plurality of IC devices;
- a pathway along which the IC devices are advanced from the input location;
- a first flexible membrane configured to receive an applied fluid pressure on a surface thereof and to contact at least one of the plurality of IC devices to stop the advancement of the at least one of the plurality of IC devices;
- and
- a second flexible membrane configured to receive an applied fluid pressure on a surface thereof and to contact at least one of the plurality of IC devices to stop the advancement of at least one of the plurality of IC devices.
A method of handling IC devices comprising:
- advancing a plurality of IC devices along a predetermined path;
- providing a first flexible membrane adjacent the predetermined path;
- providing a second flexible membrane adjacent the predetermined path;
- applying a fluid pressure to a surface of the first flexible membrane such that the first flexible membrane extends towards the predetermined path;
- contacting at least one of the plurality of IC devices with the first flexible membrane and immobilizing the at least one of the plurality of IC devices;
- and
- applying a fluid pressure to a surface of the second flexible membrane such that the second flexible membrane extends towards the predetermined path.
Dependencies are inferred from the claim text.