Bonding of a multi-layer circuit to a heat sink
OwnerJames Fraivilliginventor
Life of this patent
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Abstract
A method for manufacturing a printed circuit bonded to a heat sink includes producing the printed circuit comprising at least one conductive layer circuit pattern laminated to at least one side of a dielectric layer; first adhering a first side of a bond film to the printed circuit, wherein the first adhering conforms the printed circuit to the bond film to substantially remove air entrapment between the printed circuit and the bond film; and second adhering a second side of the bond film to the heat sink, wherein the first adhering and the second adhering bond the heat sink to the printed circuit.
Claims24
A method for manufacturing a printed circuit bonded to a heat sink, comprising:
- producing the printed circuit comprising at least one conductive layer circuit pattern laminated to at least one side of a dielectric layer;
- first adhering a first side of a bond film to the printed circuit, wherein the first adhering conforms the printed circuit to the bond film to substantially remove air entrapment between the printed circuit and the bond film;
- and
- second adhering a second side of the bond film to the heat sink.
A method for manufacturing a printed circuit bonded to a heat sink, comprising:
- producing the printed circuit comprising at least one conductive layer circuit pattern laminated to at least one side of a dielectric layer;
- stacking a plurality of circuit pre-assemblies, wherein each of the plurality of circuit pre-assemblies comprising a bond film, the printed circuit, conformance materials, and at least one release sheet;
- first adhering the plurality of circuit pre-assemblies, wherein the first adhering adheres the bond film to the printed circuit in each of the plurality of circuit pre-assemblies to produce a plurality of printed circuit-bond film assemblies;
- and
- second adhering a heat sink to each of the printed circuit-bond film assemblies.
An apparatus, comprising:
- a printed circuit comprising at least one conductive layer circuit pattern laminated to at least one side of a dielectric layer;
- a heat sink;
- and
- a bond film, wherein the bond film laminates the heat sink to the printed circuit, and wherein the bond film is tack-bonded to the printed circuit prior to laminating to the heat sink.
Dependencies are inferred from the claim text.