Dynamic targeting for a process control system

A method for dynamically adjusting processing of semiconductor wafers, comprising:

• processing a semiconductor wafer based upon a process target setting relating to at least one of a yield, quality, and performance of said semiconductor wafer in a batch;
• acquiring metrology data relating to said processed semiconductor wafer based upon at least one of a scheduled interval and a triggering event;
• acquiring electrical data relating to said processed semiconductor wafer in an approximately real time manner during processing of said batch;
• and
• adjusting dynamically said process target setting based upon analysis of said electrical data and said metrology data.

A method for dynamically adjusting a targeting system for processing semiconductor wafers, comprising:

• processing a semiconductor wafer in a batch based upon a process target;
• acquiring manufacturing data related to said processed semiconductor wafer, said manufacturing data comprising at least one of a metrology data relating to said processed workpiece and a tool state data relating to a tool state of a processing tool;
• acquiring electrical data relating to said processed semiconductor wafer during processing of said batch;
• and
• dynamically adjusting said targeting system based upon said manufacturing data and said electrical data.

An apparatus, comprising:

• means for performing a process step upon a workpiece in a batch based upon a process target setting, said process target setting comprising at least one parameter relating to a target characteristic of said first workpiece;
• means for acquiring manufacturing data relating to processing of said first workpiece, said manufacturing data comprising at least one of a metrology data relating to said processed first workpiece and a tool state data relating to the tool state of a processing tool;
• means for acquiring electrical data relating to said processed workpiece at least partially during a time period during another workpiece in said batch is under process control;
• and
• means for adjusting dynamically said process target setting based upon a correlation of said electrical data with said manufacturing data.

A computer readable program storage device encoded with instructions that, when executed by a computer, performs a method, comprising:

• performing a process step upon a workpiece in a batch based upon a process target setting, said process target setting comprising at least one parameter relating to a target characteristic of said first workpiece;
• acquiring manufacturing data relating to processing of said first workpiece, said manufacturing data comprising at least one of a metrology data relating to said processed first workpiece and a tool state data relating to the tool state of a processing tool;
• acquiring electrical data relating to said processed workpiece at least partially during a time period during another workpiece in said batch is under process control;
• and
• adjusting dynamically said process target setting based upon a correlation of said electrical data with said manufacturing data.