Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces

A polishing machine for mechanical or chemical-mechanical polishing of micro-device workpieces, comprising:

• a table having a support surface;
• a planarizing pad coupled to the support surface of the table;
• and
• a workpiece carrier assembly including a carrier head with a retaining ring and a drive system coupled to the carrier head, the retaining ring having an inner surface, an outer surface, a first surface between the inner surface and the outer surface, a first groove, and a second groove positioned at least substantially transverse to the first groove, wherein the first and second grooves are in the first surface and extend from the inner surface to the outer surface, the carrier head is configured to hold the workpiece and the drive system is configured to move the carrier head to engage the workpiece with the planarizing pad, and the carrier head and/or the table is movable relative to the other to rub the workpiece against the planarizing pad.

A polishing machine for chemical-mechanical polishing of micro-device workpieces with a solution, comprising:

• a table having a support surface;
• a planarizing pad coupled to the support surface of the table;
• and
• a workpiece carrier assembly including a carrier head with a retaining ring and a drive system coupled to the carrier head, the retaining ring being configured to flow the solution through the retaining ring when the retaining ring rotates in a first direction, and the retaining ring being configured to flow the solution through the retaining ring when the retaining ring rotates in a second direction opposite the first direction, wherein the carrier head is configured to hold the workpiece and the drive system is configured to move the carrier head to engage the workpiece with the planarizing pad, and the carrier head and/or the table is movable relative to the other to rub the workpiece against the planarizing pad.

A polishing machine for mechanical or chemical-mechanical polishing of micro-device workpieces, comprising:

• a table having a support surface;
• a planarizing pad coupled to the support surface of the table;
• and
• a workpiece carrier assembly including a carrier head with a retaining ring and a drive system coupled to the carrier head, the retaining ring including an inner surface, an outer surface, a first surface between the inner surface and the outer surface, a means for pumping the solution through the retaining ring, and a means for concurrently exhausting the solution through the retaining ring as the retaining ring rotates in the a single direction, wherein the carrier head is configured to hold the workpiece and the drive system is configured to move the carrier head to engage the workpiece with the planarizing pad, and the carrier head and/or the table is movable relative to the other to rub the workpiece against the planarizing pad.

A method of polishing a micro-device workpiece, comprising:

• retaining the workpiece with a retaining ring;
• rotating the retaining ring relative to a polishing pad in a first direction;
• passing a solution through at least a first groove in the ring having a first orientation in the retaining ring;
• and
• exhausting the solution through at least a second groove in the ring having a second orientation at least substantially transverse to the first orientation in the retaining ring.

A method of mounting a retaining ring on a polishing machine, comprising:

• mounting a first retaining ring on a first carrier head that rotates in a first direction;
• attaching a second retaining ring to a second carrier head that rotates in a second direction opposite the first direction, wherein the second retaining ring is identical to the first retaining ring;
• and
• flowing fluid through the first and second retaining rings.