Heat sink and package surface design
AssigneeIntel Corporation
InventorsSeri Lee, Phillip H. Chen
Life of this patent
Estimating the term…
Abstract
An electronic assembly that includes a heat sink, a thermal interface material, integrated circuit, and a package connected to the integrated circuit. The thermal interface material is positioned between a first surface on the package and a second surface on the heat sink to improve thermal conductivity between the package and heat sink. At least one of the first and second surfaces includes either a cavity that traps excess thermal interface material when the heat sink is compressed against the package, or a protrusion that maintains bond line thickness between the heat sink and package.
Claims24
An electronic assembly comprising:
- an integrated circuit;
- a package connected to the integrated circuit, the package including a first surface;
- a heat sink including a second surface;
- and
- a thermal interface material between the first and second surfaces, at least one of the first and second surfaces including a cavity that collects excess thermal interface material as the heat sink is compressed against the package.
An electronic assembly comprising:
- an integrated circuit;
- a package connected to the integrated circuit, the package including a first surface;
- a heat sink including a second surface;
- and
- a thermal interface material between the first and second surfaces, at least one of the first and second surfaces including a protrusion that maintains bond line thickness between the heat sink and the package.
A computer system comprising:
- a bus;
- a memory coupled to the bus;
- and
- an electronic assembly including a heat sink, a thermal interface material, and a processor within a package that is electrically connected to the bus, the package including a first surface and the heat sink including a second surface with the thermal interface material between the first and second surfaces, at least one of the first and second surfaces including a cavity that collects excess thermal interface material as the heat sink is compressed against the package.
A computer system comprising:
- a bus;
- a memory coupled to the bus;
- and
- an electronic assembly including a processor within a package that is electrically connected to the bus, a heat sink and a thermal interface material, the package including a first surface and the heat sink including a second surface with the thermal interface material between the first and second surfaces, at least one of the first and second surfaces including a protrusion that maintains bond line thickness between the heat sink and the package.
A kit of parts to form an electronic assembly, the kit comprising:
- an integrated circuit;
- a package to be coupled to the integrated circuit, the package including a first surface;
- a heat sink to be coupled to the package, the heat sink including a second surface;
- and
- a thermal interface material to be placed between the first and second surfaces, at least one of the first and second surfaces including a cavity that collects excess thermal interface material as the heat sink is compressed against the package.
A kit of parts to form an electronic assembly, the kit comprising:
- an integrated circuit;
- a package to be coupled to the integrated circuit, the package including a first surface;
- a heat sink to be coupled to the package, the heat sink including a second surface;
- and
- a thermal interface material to be placed between the first and second surfaces, at least one of the first and second surfaces including a protrusion that maintains bond line thickness between the heat sink and the package when the heat sink is thermally engaged with the package.
Dependencies are inferred from the claim text.