US 2004/0017536 A1Published application

Display device

AssigneesHitachi Displays, Ltd., Hitachi Device Engineering Co., Ltd.

InventorYuuichi Takenaka

Life of this patent

Estimating the term…

Loading patent…

Abstract

In a display device including a display panel and a multi-layered printed circuit board which is arranged along one side of the display panel and is electrically connected to a plurality of leads of the display panel through a plurality of tape carrier packages, according to the present invention, a plurality of slits or notches are formed in a sheet fiber member which is impregnated with resin and constitutes a base sheet of the multi-layered printed circuit board along one side of the display panel. The discontinuity of the sheet fiber member formed by the slits or the notches absorbs the difference in thermal expansion of the multi-layered printed circuit board and the display panel due to the change of an ambient temperature of the display device and hence, it is possible to prevent peeling of the tape carrier package from the display panel or breaking of the tape carrier package per se.

Claims12

Dependent claims

A display device comprising:

an insulating substrate which has a large number of electrodes, having an end periphery thereof on which a plurality of leads which supply signals for image display to the respective electrodes are formed;
a multi-layered printed circuit board which is arranged along the end periphery and includes wiring for transmitting the signals for image display along the end periphery;
and
a plurality of printed circuit boards for bridging which are arranged in parallel along the end periphery of the insulating substrate, wherein for every one of a plurality of groups of leads formed by dividing the plurality of leads along the end periphery, each printed circuit board bridges the wiring of the multi-layered printed circuit board with one of the plurality of groups of leads, wherein
the multi-layered printed circuit board includes at least a unit which has at least one base sheet which is formed by impregnating an insulating sheet fiber member with resin and conductive layers which are stacked and fixed to the base sheet and are insulated from each other by the base sheet, and imperfect connection parts which attenuate an elongation and a shrinkage of the multi-layered printed circuit board in the longitudinal direction in plane of the base sheet are formed at a portion of the sheet fiber member of the base sheet.

2 more elements

A display device comprising:

an insulating substrate which has a main surface on which a plurality of electrodes contributing to an image display operation are formed, wherein a plurality of leads which supply signals to the plurality of respective electrodes are arranged in parallel along at least one side of the main surface of the insulating substrate;
a multi-layered printed circuit board which has wiring for transmitting the signals along at least one side of the main surface of the insulating substrate;
and
a plurality of printed circuit boards which respectively bridge a distance between the multi-layered printed circuit board and at least one side of the main surface of the insulating substrate, and supply the signal to at least one of groups of the plurality of leads which are formed in a divided manner at least along one side of the main surface from the multi-layered printed circuit board, wherein
the multi-layered printed circuit board has a laminated structure which includes at least a base sheet formed of an insulating sheet fiber member impregnated with resin and a conductive layer formed on the base sheet and insulated from the base sheet,
the extension direction of the base sheet is arranged along at least one side of the main surface of the insulating substrate, and
a plurality of discontinued areas in the extending direction of the base sheet are formed in the insulating sheet fiber member.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/624,601Filed 23 Jul 2003
Priority: JP 2002-21804226 Jul 2002
Published: 29 Jan 2004
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

G02F 1/13452
Conductors connecting electrodes to cell terminals: conductors connecting driver circuitry and terminals of panels
H05K 1/0271
Details: arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal…
H05K 1/0298
Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295: multilayer circuits
H05K 1/0366
Consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement: reinforced, e.g. by fibres, fabrics